Document Center List of Standards on Printed Circuits And Boards
ICS Code 31.180
Return to ICS Index.Up to Level 1:
The following documents are a part of this series:
ASTM:
- ASTM-B885 - Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
- ASTM-D1867 - Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring (Withdrawn 2020)
- ASTM-D3380 - Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates
- ASTM-D5109 - Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)
- ASTM-F1896 - Test Method for Determining the Electrical Resistivity of a Printed Conductive Material (Withdrawn 2023)
- ASTM-F3290 - Standard Guide for Handling and Application of a Membrane Switch or Printed Electronic Device to its Final Support Structure (Withdrawn 2023)
BSI:
- BS-123000 - System of quality assessment. Generic specification. Printed boards
- BS-123100 - System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes
- BS-123100-003 - System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes
- BS-123200 - System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes
- BS-123200-003 - System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes
- BS-123300 - System of quality assessment. Sectional specification. Rigid multilayer printed boards
- BS-123300-003 - System of quality assessment. Capability detail specification. Rigid multilayer printed boards
- BS-123400 - System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards without through-connections
- BS-123400-003 - System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections
- BS-123500 - System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections
- BS-123500-003 - System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections
- BS-123600 - System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
- BS-123600-003 - System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
- BS-123700 - System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections
- BS-123700-003 - System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections
- BS-123800 - System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections
- BS-123800-003 - System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
- BS-4584-103.1 - Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
- BS-4584-103.3 - Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
- BS-4584-11 - Specification for metal-clad base materials for printed circuits
- BS-4584-15 - Part 15: Adhesive Coated Polymeric Films: PETP-F-15 & Pi-F-15, Metal-Clad Base Materials F
- BS-4727-1-GROUP-11 - Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms. Terms common to power,telecommunications and electronics
- BS-6221-10 - Printed wiring boards. Specification for flex-rigid double-sided printed boards with through connections
- BS-6221-11 - Printed wiring boards. Specification for flex-rigid multilayer printed boards with through connections
- BS-6221-12 - Printed wiring boards. Specification for mass lamination panels (semi-manufactured multilayer printed boards)
- BS-6221-2 - Printed wiring boards. Methods of test
- BS-6221-21 - Printed wiring boards
- BS-6221-22 - Part 22: Guide To the Use of Printed Wiring Board Substratematerials: Surface Mount Tech
- BS-6221-24 - Printed wiring boards. Guide for the production of artwork
- BS-6221-25 - Printed wiring boards. Guide to the rework and repair of soldered surface mounted printed board assemblies
- BS-6221-3 - Printed wiring boards. Guide for the design and use of printed wiring boards
- BS-6221-4 - Printed wiring boards. Method for specifying single and double sided printed wiring boards with plain holes
- BS-6221-5 - Printed wiring boards. Specification for single and double sided rigid printed boards with plated-through holes
- BS-6221-7 - Printed wiring boards. Method for specifying single and double sided flexible printed wiring boards without through connections
- BS-6221-8 - Printed wiring boards. Method for specifying single and double sided flexible printed wiring boards with through connections
- BS-6221-9 - Printed wiring boards. Specification for flexible multilayer boards with through connections
- BS-6943 - Classification of shapes of electronic components for placement on printed wiring boards
- BS-7588 - Guide to hierarchical interconnection technology
- BS-9760 - Specification for Printed Circuits of Assessed Quality: Generic Data & Methods of Test
- BS-9761 - Sectional Specification for Capability Approval of Manufacturers of Multilayer Rigid P
- BS-9762 - Sectional Specification for Capability Approval of Manufacture of Double-Sided Rigid P
- BS-CECC-200025 - Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
- BS-CECC-23100-801 - Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plain holes
- BS-CECC-23200-801 - Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plated through holes
- BS-CECC-23300-801 - Harmonized system of quality assessment for electronic components. Capability detail specification: multi-layer printed boards
- BS-CECC-23600-801 - Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections
- BS-CECC-23700-801 - Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid double-sided printed boards with through connections
- BS-CECC-23800-801 - Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections
- BS-CECC-265001 - Harmonized system of quality assessment for electronic components. Technology approval schedule. Film and hybrid integrated circuits
- BS-CESS-23100-801 - Harmonized System of Quality Assessment for Electronic Components, Capability Detail S
- BS-EN-123000 - Harmonized system of quality assessment for electronic components. Generic specification: printed boards
- BS-EN-123100 - Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes
- BS-EN-123200 - Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plated through holes
- BS-EN-123300 - Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
- BS-EN-123600 - Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections
- BS-EN-16602-70-10 - Space product assurance. Qualification of printed circuit boards
- BS-EN-16602-70-11 - Space product assurance. Procurement of printed circuit boards
- BS-EN-16602-70-12 - Space product assurance. Design rules for printed circuit boards
- BS-EN-16602-70-60 - Space product assurance. Qualification and Procurement of printed circuit boards
- BS-EN-60194 - Printed board design, manufacture and assembly. Terms and definitions
- BS-EN-60249-1 - Part 1: Test Methods, Base Materials for Printed Circuits
- BS-EN-60249-2-10 - Epoxide Non-Woven/Woven Glass Reinforced Copper-Clad Laminated Sheet of Defined Flamma
- BS-EN-60249-2-11 - Specification for Thin Epoxide Woven Glass Fabric Copper-Clad Laminated Sheet, General
- BS-EN-60249-2-12 - Part 2-12: Specifications - Specification No. 12: Thin Epoxide Woven Glass Fabric Copper-C
- BS-EN-60249-2-13 - Flexible Copper-Clad Polyimide Film, General Purpose Grade
- BS-EN-60249-2-14 - Phenolic Cellulose Paper Copper-Clad Laminated Sheet of Defined Flammability (Vertical
- BS-EN-60249-2-15 - Part 2: Specifications, Specification No. 15. Flexible Copper-Clad Polyimide Film, of Defi
- BS-EN-60249-2-16 - Specification No. 16. Polyimide Woven Glass Fabric Copper-Clad Laminated Sheet of Defi
- BS-EN-60249-2-17 - Specification No. 17. Thin Polyimide Woven Glass Fabric Copper-Clad Laminated Sheet Of
- BS-EN-60249-2-18 - Specification No. 18. Bismaleimide/Triazine Modified Epoxidewoven Glass Fabric Copper-
- BS-EN-60249-2-19 - Specification No. 19. Thin Bismaleimide/Triazine Modified Epoxide Woven Glass Fabric C
- BS-EN-60249-2-3 - Metal-Clad Base Materials for Printed Wiring Boards. Copper-Clad Base Material. Specif
- BS-EN-60249-2-4 - Specification for Epoxide Woven Glass Fabric Copper-Clad Laminated Sheet, General Purp
- BS-EN-60249-2-5 - Specification No 5. Epoxide Woven Glass Fabric Copper-Clad Laminated Sheet of Defined
- BS-EN-60249-2-8 - Part 2: Specifications, Specification No. 8. Flexible Copper-Clad Polyester (Petp) Film, B
- BS-EN-60249-2-9 - Epoxide Cellulose Paper Core, Epoxide Glass Cloth Surfaces Copper-Clad Laminated Sheet
- BS-EN-60947-4-3 - Low-voltage switchgear and controlgear
- BS-EN-61076-4-114 - Connectors for electronic equipment. Printed board connectors with assessed quality
- BS-EN-61182-2-2 - Printed board assembly products. Manufacturing description data and transfer methodology
- BS-EN-61188-5-3 - Printed boards and printed board assemblies. Design and use
- BS-EN-61188-5-4 - Printed boards and printed board assemblies. Design and use
- BS-EN-61188-5-5 - Printed boards and printed board assemblies. Design and use
- BS-EN-61188-5-8 - Printed boards and printed board assemblies. Design and use
- BS-EN-61188-7 - Printed boards and printed board assemblies. Design and use
- BS-EN-61189-1 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- BS-EN-61189-11 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- BS-EN-61189-2 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- BS-EN-61189-2-719 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- BS-EN-61189-2-721 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- BS-EN-61189-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- BS-EN-61189-3-719 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- BS-EN-61189-5 - Test methods for electrical materials, interconnection structures and assemblies
- BS-EN-61189-5-1 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- BS-EN-61189-5-2 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- BS-EN-61189-5-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- BS-EN-61189-5-4 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- BS-EN-61189-6 - Test methods for electrical materials, interconnection structures and assemblies
- BS-EN-61191-1 - Printed board assemblies
- BS-EN-61191-3 - Printed board assemblies
- BS-EN-61191-3-TC - Tracked Changes. Printed board assemblies
- BS-EN-61191-4 - Printed board assemblies
- BS-EN-61191-6 - Printed board assemblies
- BS-EN-61193-1 - Quality assessment systems
- BS-EN-61249-2-1 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-2-11 - Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad
- BS-EN-61249-2-18 - Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad
- BS-EN-61249-2-19 - Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad
- BS-EN-61249-2-2 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-2-22 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-2-23 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-2-26 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-2-27 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-2-30 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-2-35 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-2-36 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-2-37 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-2-38 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-2-39 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-2-4 - Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad
- BS-EN-61249-2-40 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-2-41 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-2-42 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-2-43 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-2-44 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-2-5 - Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad
- BS-EN-61249-2-6 - Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad
- BS-EN-61249-2-7 - Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
- BS-EN-61249-2-8 - Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad
- BS-EN-61249-4-1 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-4-11 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-4-12 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-4-14 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-4-15 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-4-16 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-4-17 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-4-18 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-4-19 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-4-2 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-4-5 - Materials for printed boards and other interconnecting structures
- BS-EN-61249-5-1 - Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings. Copper foils (for the manufacture of copper-clad base materials)
- BS-EN-61249-8-7 - Materials for interconnection structures. Sectional specification set for non-conductive films and coatings
- BS-EN-61249-8-8 - Materials for interconnection structures. Sectional specification set for non-conductive films and coatings. Temporary polymer coatings
- BS-EN-62326-1 - Printed boards
- BS-EN-62326-20 - Printed boards
- BS-EN-62496-1 - Optical circuit boards
- BS-EN-62496-3 - Optical circuit boards
- BS-EN-62496-3-1 - Optical circuit boards. Performance standard
- BS-EN-62496-4 - Optical circuit boards
- BS-EN-62878-1-1 - Device embedded substrate
- BS-EN-IEC-61188-6-1 - Circuit boards and circuit board assemblies. Design and use
- BS-EN-IEC-61188-6-2 - Circuit boards and circuit board assemblies. Design and use
- BS-EN-IEC-61188-6-4 - Printed boards and printed board assemblies. Design and use
- BS-EN-IEC-61189-2-501 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- BS-EN-IEC-61189-2-630 - Test methods for electrical materials, printed board and other interconnection structures and assemblies
- BS-EN-IEC-61189-2-801 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 2-801: Thermal conductivity test for base materials
- BS-EN-IEC-61189-2-803 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- BS-EN-IEC-61189-2-804 - Test methods for electrical materials, printed board and other interconnection structures and assemblies
- BS-EN-IEC-61189-2-807 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- BS-EN-IEC-61189-5-301 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- BS-EN-IEC-61189-5-501 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- BS-EN-IEC-61189-5-502 - Test methods for electrical materials, printed board and other interconnection structures and assemblies
- BS-EN-IEC-61189-5-503 - Test methods for electrical materials, printed board and other interconnection structures and assemblies
- BS-EN-IEC-61189-5-601 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- BS-EN-IEC-61191-1 - Printed board assemblies
- BS-EN-IEC-61191-1-TC - Tracked Changes. Printed board assemblies
- BS-EN-IEC-61249-2-46 - Materials for printed boards and other interconnecting structures
- BS-EN-IEC-61249-2-47 - Materials for printed boards and other interconnecting structures
- BS-EN-IEC-61249-2-51 - Materials for printed boards and other interconnecting structures
- BS-EN-IEC-61249-6-3 - Materials for printed boards and other interconnecting structures
- BS-EN-IEC-61249-6-3-TC - Tracked Changes. Materials for printed boards and other interconnecting structures
- BS-EN-IEC-62496-2-5 - Optical circuit boards. Basic test and measurement procedures
- BS-EN-IEC-62878-2-602 - Device embedding assembly technology
- BS-EN-IEC-63203-402-1 - Wearable electronic devices and technologies
- BS-EN-IEC-63203-402-2 - Wearable electronic devices and technologies
- BS-EN-IEC-63203-406-1 - Wearable electronic devices and technologies
- BS-EN-IEC-63203-801-1 - Wearable electronic devices and technologies
- BS-EN-IEC-63251 - Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
- BS-IEC-61182-2 - Printed board assembly products. Manufacturing description data and transfer methodology
- BS-IEC-61189-2-801 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies.
- BS-IEC-61189-2-804 - Test methods for electrical materials, printed board and other interconnection structures and assemblies
- BS-IEC-61189-5-2 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering flux for printed board assemblies
- BS-IEC-61189-5-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies
- BS-IEC-61189-5-4 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
- BS-IEC-62899-201 - Printed electronics
- BS-IEC-62899-201-2 - Printed electronics
- BS-IEC-62899-202 - Printed electronics
- BS-IEC-62899-202-10 - Printed electronics
- BS-IEC-62899-202-5 - Printed electronics
- BS-IEC-62899-202-6 - Printed electronics
- BS-IEC-62899-202-7 - Printed electronics
- BS-IEC-62899-202-8 - Printed electronics
- BS-IEC-62899-202-9 - Printed electronics
- BS-IEC-62899-202-TC - Tracked Changes. Printed electronics
- BS-IEC-62899-204 - Printed electronics
- BS-IEC-62899-301-2 - Printed electronics
- BS-IEC-62899-302-2 - Printed electronics
- BS-IEC-62899-303-1 - Printed electronics
- BS-IEC-62899-401 - Printed electronics
- BS-IEC-62899-402-1 - Printed electronics
- BS-IEC-62899-402-2 - Printed electronics
- BS-IEC-62899-403-1 - Printed electronics
- BS-IEC-63055 - Format for LSI-Package-Board Interoperable design
- BS-QC-200012 - Process assessment schedule for printed board design facilities
- DD-IEC/PAS-61249-3-1 - Materials for printed boards and other interconnecting structures
- DD-IEC/PAS-61249-6-3 - Specification for finished fabric woven from E glass for printed boards
- DD-IEC/PAS-62326-7-1 - Performance guide for single- and double-sided flexible printed wiring boards
- PD-IEC-61188-8 - Circuit boards and circuit board assemblies. Design and use
- PD-IEC-61189-3-301 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- PD-IEC-61189-3-914 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- PD-IEC-61189-5-506 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies
- PD-IEC-61191-7 - Printed board assemblies
- PD-IEC-62866 - Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
- PD-IEC-62878-2-1 - Device embedded substrate
- PD-IEC-62878-2-10 - Device embedding assembly technology
- PD-IEC-62878-2-2 - Device embedded substrate
- PD-IEC-62878-2-3 - Device embedded substrate
- PD-IEC-62878-2-4 - Device embedded substrate
- PD-IEC-62878-2-7 - Device embedding assembly technology
- PD-IEC-62878-2-9 - Device embedding assembly technology
- PD-IEC-62899-250 - Printed electronics
- PD-IEC-62899-402-4 - Printed electronics
- PD-IEC-63017 - Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations
- PD-IEC-63018 - Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials
- PD-IEC-PAS-61191-10 - Printed board assemblies
- PD-IEC/PAS-61249-8-1 - Qualification and performance of electrical insulating compound for printed wiring assemblies
- PD-IEC/PAS-61249-8-5 - Qualification and performance specification of permanent solder mask and flexible cover materials
- PD-IEC/PAS-62878-2-5 - Device embedded substrate. Guidelines. Data format
- PD-IEC-TR-62878-2-8 - Device embedding assembly technology
IEC:
- IEC-1182-1 - Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form
- IEC-1182-7 - Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form
- IEC-1249-5-1 - Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
- IEC-1249-5-4 - Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
- IEC-1249-7-1 - Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper
- IEC-1249-8-7 - Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
- IEC-2326-4 - Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
- IEC-2326-4-1 - Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
- IEC-50(541) - International Electrotechnical Vocabulary. Chapter 541: Printed circuits
- IEC-60050-541-AM1 - Amendment 1 - International Electrotechnical Vocabulary - Part 541: Printed circuits
- IEC-60194 - Printed board design, manufacture and assembly - Terms and definitions
- IEC-60194-1 - Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
- IEC-60194-2 - Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
- IEC-60249-2-7 - Part 2: Specifications, Specification No. 7: Phenolic Cellulose Paper Copper-Clad Laminate
- IEC-61182-10 - Printed boards - Electronic data description and transfer - Part 10: Electronic data hierarchy
- IEC-61182-2 - Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
- IEC-61182-2-2 - Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
- IEC-61188-1-1 - Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
- IEC-61188-1-2 - Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
- IEC-61188-5-1 - Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
- IEC-61188-5-2 - Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
- IEC-61188-5-3 - Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
- IEC-61188-5-4 - Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
- IEC-61188-5-5 - Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
- IEC-61188-5-8 - Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
- IEC-61188-6-1 - Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
- IEC-61188-6-2 - Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
- IEC-61188-6-4 - Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
- IEC-61188-7 - Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
- IEC-61188-8 - Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library
- IEC-61189-1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
- IEC-61189-11 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
- IEC-61189-1-1 - Amendment 1
- IEC-61189-2 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
- IEC-61189-2-501 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
- IEC-61189-2-630 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures . Moisture absorption after pressure vessel conditioning
- IEC-61189-2-719 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
- IEC-61189-2-720 - Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
- IEC-61189-2-721 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator
- IEC-61189-2-804 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
- IEC-61189-2-807 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
- IEC-61189-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
- IEC-61189-3-301 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB
- IEC-61189-3-719 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
- IEC-61189-3-913 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
- IEC-61189-3-914 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
- IEC-61189-5 - Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
- IEC-61189-5-1 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
- IEC-61189-5-2 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
- IEC-61189-5-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
- IEC-61189-5-301 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
- IEC-61189-5-4 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
- IEC-61189-5-501 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
- IEC-61189-5-502 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies
- IEC-61189-5-503 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
- IEC-61189-5-504 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)
- IEC-61189-5-506 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
- IEC-61189-5-601 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
- IEC-61189-6 - Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
- IEC-61191-6 - Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
- IEC-61191-7 - Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
- IEC-61191-8 - Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
- IEC-61191-9 - Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices
- IEC-61249-2-1 - Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
- IEC-61249-2-10 - Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
- IEC-61249-2-11 - Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flamm (TITLE TRUNCATED)
- IEC-61249-2-12 - Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
- IEC-61249-2-13 - Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
- IEC-61249-2-18 - Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad
- IEC-61249-2-19 - Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test), copper clad
- IEC-61249-2-2 - Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
- IEC-61249-2-21 - Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
- IEC-61249-2-22 - Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
- IEC-61249-2-23 - Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
- IEC-61249-2-26 - Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical bur (TITLE TRUNCATED)
- IEC-61249-2-27 - Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
- IEC-61249-2-30 - Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
- IEC-61249-2-31 - Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
- IEC-61249-2-32 - Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
- IEC-61249-2-33 - Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
- IEC-61249-2-34 - Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
- IEC-61249-2-35 - Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC-61249-2-36 - Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC-61249-2-37 - Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC-61249-2-38 - Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC-61249-2-39 - Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC-61249-2-4 - Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad
- IEC-61249-2-40 - Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC-61249-2-41 - Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC-61249-2-42 - Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC-61249-2-43 - Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC-61249-2-44 - Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC-61249-2-45 - Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m.K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC-61249-2-46 - Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m.K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC-61249-2-47 - Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m.K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
- IEC-61249-2-5 - Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined (TITLE TRUNCATED)
- IEC-61249-2-51 - Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
- IEC-61249-2-6 - Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning (TITLE TRUNCATED)
- IEC-61249-2-7 - Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
- IEC-61249-2-8 - Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
- IEC-61249-2-9 - Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
- IEC-61249-3-3 - Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
- IEC-61249-3-4 - Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
- IEC-61249-3-5 - Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
- IEC-61249-4-1 - Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woen E-glass prepreg of defined flammability
- IEC-61249-4-11 - Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
- IEC-61249-4-12 - Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
- IEC-61249-4-14 - Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
- IEC-61249-4-15 - Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
- IEC-61249-4-16 - Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
- IEC-61249-4-17 - Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
- IEC-61249-4-18 - Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
- IEC-61249-4-19 - Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
- IEC-61249-4-2 - Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
- IEC-61249-4-5 - Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
- IEC-61249-6-3 - Materials for printed boards and other interconnecting structures . Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from .E. glass for printed boards
- IEC-61249-8-8 - Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
- IEC-62326-1 - Printed boards - Part 1: Generic specification
- IEC-62326-20 - Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
- IEC-62496-1 - Optical circuit boards - Part 1: General
- IEC-62496-3-1 - Optical circuit boards - Part 3-1: Performance standards - Flexible optical circuit boards using unconnectorized optical glass fibres
- IEC-62866 - Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
- IEC-62878-1 - Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
- IEC-62878-1-1 - Device embedded substrate - Part 1-1: Generic specification - Test methods
- IEC-62878-2-1 - Device embedded substrate - Part 2-1: Guidelines - General description of technology
- IEC-62878-2-2 - Device embedded substrate - Part 2-2: Guidelines - Electrical testing
- IEC-62878-2-3 - Device embedded substrate - Part 2-3: Guidelines - Design guide
- IEC-62878-2-4 - Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
- IEC-62878-2-5 - Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
- IEC-62878-2-602 - Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
- IEC-62878-2-7 - Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
- IEC-62878-2-8 - Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
- IEC-62878-2-9 - Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
- IEC-62899-201 - Printed electronics - Part 201: Materials - Substrates
- IEC-62899-201-2 - Printed electronics - Part 201-2: Materials - Substrates - Measurement methods for properties of stretchable substrates
- IEC-62899-201-AM1 - Amendment 1 - Printed electronics - Part 201: Materials - Substrates
- IEC-62899-202 - Printed electronics - Part 202: Materials - Conductive ink
- IEC-62899-202-10 - Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer
- IEC-62899-202-3 - Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method
- IEC-62899-202-4 - Printed electronics - Part 202-4: Materials - Conductive ink - Measurement methods for properties of stretchable printed layers (conductive and insulating)
- IEC-62899-202-5 - Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
- IEC-62899-202-6 - Printed electronics - Part 202-6: Materials - Conductive ink - Measurement method for resistance changes under high temperature and humidity - Printed conductive layer on a flexible substrate
- IEC-62899-202-8 - Printed electronics - Part 202-8: Materials - Conductive ink - Measurement of difference in resistance of printing direction of conductive film fabricated with wire-shaped materials
- IEC-62899-202-9 - Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test
- IEC-62899-202-RL - Printed electronics - Part 202: Materials - Conductive ink
- IEC-62899-204 - Printed electronics - Part 204: Materials - Insulator ink - Measurement methods of properties of insulator inks and printed insulating layers
- IEC-62899-250 - Printed electronics - Part 250: Material technologies required in printed electronics for wearable smart devices
- IEC-62899-401 - Printed electronics - Part 401: Printability - Overview
- IEC-62899-402-1 - Printed electronics - Part 402-1: Printability - Measurement of qualities - Pattern width
- IEC-62899-402-2 - Printed electronics - Part 402-2: Printability - Measurement of qualities - Edge waviness
- IEC-62899-402-3 - Printed electronics - Part 402-3: Printability - Measurement of qualities - Voids in printed pattern using a two-dimensional optical image
- IEC-62899-402-4 - Printed electronics - Part 402-4: Printability - Measurement of qualities - Classification and measurement methods for morphology
- IEC-62899-403-1 - Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine
- IEC-63017 - Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations
- IEC-63018 - Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials
- IEC-63055 - Format for LSI-Package-Board Interoperable design
- IEC-63251 - Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
- IEC-97 - Grid systems for printed circuits
- IEC/PAS-61182-12 - Generic requirements for printed board assembly products manufacturing description data and transfer methodology
- IEC/PAS-61189-3-913 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test methods for interconnection structures (printed boards) - Electronic circuit board for high-brightness LEDs
- IEC/PAS-61191-10 - Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
- IEC/PAS-61249-3-1 - Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
- IEC/PAS-61249-6-3 - Specification for finished fabric woven from ""E"" glass for printed boards
- IEC/PAS-61249-8-1 - Qualification and performance of electrical insulating compound for printed wiring assemblies
- IEC/PAS-61249-8-5 - Qualification and performance specification of permanent solder mask and flexible cover materials
- IEC/PAS-62158 - Printed Board Manufacturers' Qualification Profile (MQP)
- IEC/PAS-62159 - Electronic Assembly Manufacturers' Qualification Profile (Aqp)
- IEC/PAS-62160 - Laminator Qualification Profile
- IEC/PAS-62212 - Specification & Characterization Methods for Nonwoven 'E' Glass Mat
- IEC/PAS-62213 - Specification & Characterization Methods for Nonwoven Para-Aramid Reinforcement
- IEC/PAS-62214 - Generic Performance Specification for Printed Boards
- IEC/PAS-62326-14 - Printed boards - Part 14: Device embedded substrate - Terminology / reliability / design guide
- IEC/PAS-62326-20 - Printed boards - Part 20: Electronic circuit board for high-brightness LEDs
- IEC/PAS-62326-7-1 - Performance guide for single- and double-sided flexible printed wiring boards
- IEC/PAS-62878-2-5 - Device embedded substrate - Guidelines - Data format
Other SDOs:
- BS-EN-IEC-61189-5-504 - Test methods for electrical materials, printed board and other interconnection structures and assemblies
- EN-16602-70-10 - Space product assurance - Qualification of printed circuit boards
- EN-16602-70-11 - Space product assurance - Procurement of printed circuit boards
- EN-16602-70-12 - Space product assurance - Design rules for printed circuit boards
- EN-16602-70-60 - Space product assurance - Qualification and Procurement of printed circuit boards
- EN-60194 - Printed Board Design, Manufacture & Assembly - Terms & Definitions
- EN-60249-2-13 - Base Material for Printed Circuits, Specifications, Flexible Copper-Clad Polyimide Fil
- EN-60249-2-14 - Specification No.14: Phenolic Cellulose Paper Copper-Clad Liminated Sheet of Defined F
- EN-60249-2-19 - Specifications, Specification No. 19, Thin Bismaleimide/Triazine Modified Epoxide Wove
- EN-60249-2-3 - Specifications, Metal-Cald Base Materials for Printed Wiring Boards, Copper-Clad Base
- EN-60249-2-4 - Specifications, Specification for Epoxide Woven Glass Fabric Copper-Clad Laminated She
- EN-60947-4-3 - Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters - AC semiconductor controllers and contactors for non-motor loads
- EN-61182-2-2 - Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
- EN-61188-5-3 - Printed Boards & Printed Board Assemblies, Design & Use, Attachment (Land/Joint) Consi
- EN-61188-5-4 - Printed Boards & Printed Board Assemblies, Design & Use, Attachments (Land/Joint) Cons
- EN-61188-5-5 - Printed Boards & Printed Board Assemblies, Design & Use, Attachment (Land/Joint) Consi
- EN-61188-5-8 - Printed Boards & Printed Board Assemblies, Design & Use, Attachments (Land/Joint) Cons
- EN-61188-6-4 - Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (IEC 61188-6-4:2019)
- EN-61188-7 - Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
- EN-61189-11 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
- EN-61189-2 - Part 2: Test Methods for Materials for Interconnection Structures
- EN-61189-2-719 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
- EN-61189-2-721 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
- EN-61189-3 - Test Methods for Electrical Materials, Printed Boards & Other Interconnection Structur
- EN-61189-3-719 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
- EN-61189-5 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
- EN-61189-5-1 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
- EN-61189-5-2 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
- EN-61189-5-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
- EN-61189-5-4 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
- EN-61189-6 - Test Methods for Electrical Materials, Interconnection Structures & Assemblies, Test M
- EN-61191-6 - Part 6: Evaluation Criteria for Voids in Soldered Joints of Bga & Lga & Measurement M
- EN-61249-2-10 - Materials for Printed Boards & Other Interconnecting Structures, Reinforced Base Mater
- EN-61249-2-18 - Materials for Interconnection Structures, Sectional Specification Set for Reinforced B
- EN-61249-2-19 - Reinforced Base Materials, Clad & Unclad. Epoxide Cross-Plied Linear FIBREGLASS-Reinfo
- EN-61249-2-27 - Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
- EN-61249-2-30 - Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
- EN-61249-2-35 - Part 2-35: Reinforced Base Materials, Clad & Unclad - Modified Epoxide Woven E-Glass L
- EN-61249-2-36 - Part 2-36: Reinforced Base Materials, Clad & Unclad - Epoxide Woven E-Glass Laminate S
- EN-61249-2-37 - Part 2-37: Reinforced Base Materials, Clad & Unclad - Modified Non-Halogenated Epoxide
- EN-61249-2-38 - Part 2-38: Reinforced Base Materials, Clad & Unclad - Non-Halogenated Epoxide Woven E-
- EN-61249-2-39 - Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- EN-61249-2-4 - Materials for Interconnection Structures, Sectional Specification Set for Reinforced B
- EN-61249-2-40 - Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- EN-61249-2-41 - Part 2-41: Reinforced Base Materials Clad & Unclad - Brominated Epoxide Cellulose Pape
- EN-61249-2-42 - Part 2-42: Reinforced Base Materials Clad & Unclad - Brominated Epoxide Non-Woven / Wo
- EN-61249-2-43 - Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- EN-61249-2-44 - Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- EN-61249-2-5 - Materials for Printed Boards & Other Interconnecting Structures, Reinforced Base Mater
- EN-61249-2-6 - Materials for Printed Boards & Other Interconnecting Structures, Reinforced Base Mater
- EN-61249-2-7 - Reinforced Base Materials Clad & Unclad. Epoxide Woven E-Glass Laminated Sheet of Defi
- EN-61249-2-8 - Materials for Interconnection Structures, Sectional Specification Set for Reinforced B
- EN-61249-4-1 - Materials for Printed Boards & Other Interconnecting Structures, Sectional Specificati
- EN-61249-4-14 - Part 4-14: Sectional Specification Set for Prepreg Materials, Unclad (for the Manufact
- EN-61249-4-15 - Part 4-15: Sectional Specification Set for Prepreg Materials, Unclad (for the Manufact
- EN-61249-4-16 - Part 4-16: Sectional Specification Set for Prepreg Materials, Unclad (for the Manufact
- EN-61249-4-17 - Part 4-17: Sectional Specification Set for Prepreg Materials, Unclad (for the Manufact
- EN-61249-4-18 - Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
- EN-61249-4-19 - Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
- EN-61249-8-8 - Materials for Interconnection Structures, Sectional Specification Set for Non-Conducti
- EN-62326-20 - Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
- EN-62496-1 - Optical Circuit Boards, General
- EN-62496-3-1 - Part 3-1: Flexible Optical Circuit Boards Using Unconnectorized Optical Glass Fibres,
- EN-62878-1-1 - Device embedded substrate - Part 1-1: Generic specification - Test methods
- EN-IEC-61249-2-45 - Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Nonhalogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
- EN-IEC-61249-2-46 - Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Nonhalogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
- EN-IEC-61249-2-47 - Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Nonhalogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (2.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
- IPC-2581 - Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
- IPC-2582 - Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description
- IPC-2583 - Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description
- IPC-2584 - Sectional Requirements for Implementation of Printed Board Fabrication Data Descriptio
- IPC-2588 - Sectional Requirements for Implementation of Part List Product Data Description
- JIS-C-6485 - Base materials for printed circuits -- Paper base, phenolic resin
- PD-IEC-61191-8 - Printed board assemblies
- SS-EN-16602-70-10 - Space product assurance - Qualification of printed circuit boards
- SS-EN-16602-70-11 - Space product assurance - Procurement of printed circuit boards
- SS-EN-16602-70-12 - Space product assurance - Design rules for printed circuit boards
- SS-EN-16602-70-60 - Space product assurance - Qualification and Procurement of printed circuit boards