ASTM-B490 Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits

ASTM-B490 - 2009 R21 EDITION - CURRENT
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Standard Practice for Micrometer Bend Test for Ductility of Electrodeposits
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Scope

1.1 This practice describes a procedure for measuring the ductility of electrodeposited foils.

1.2 This practice is suitable only for the evaluation of electrodeposits having low ductility.

1.3 The obtained ductility values must only be considered semi-quantitative because this test has a significant operator dependence.

1.4 This practice is best used for in-house process control where measurements are always made by the same operator. A change in ductility value can be used as an indication of possible changes in the electroplating solution.

1.5 This standard does not purport to address the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Keywords

Bend testing-coatings; electrodeposited foils-ductility, by micrometer bend method, practice,; Ductility; ductility of electrodeposits, micrometer test,; Electrodeposited coatings; ductility, of electrodeposited foils, by micrometer bend test,; practice,; Foil; electrodeposited, ductility by micrometer bend test, practice,; Micrometer bend test; ductility of electrodeposited foils, practice; ICS Number Code 17.040.20 (Properties of surfaces); 25.220.40 (Metallic coatings)

To find similar documents by ASTM Volume:

02.05 (Metallic and Inorganic Coatings; Metal Powders and Metal Powder Products)

To find similar documents by classification:

17.040.20 (Properties of surfaces)

25.220.40 (Metallic coatings Including electrolytic depositions, cathodic coatings, autocatalytic coatings, etc.)

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Document Number

ASTM-B0490-09R21

Revision Level

2009 R21 EDITION

Status

Current

Modification Type

Reapproval

Publication Date

May 10, 2021

Document Type

Practice

Page Count

2 pages

Committee Number

B08.10