ASTM-D1151 Standard Practice for Effect of Moisture and Temperature on Adhesive Bonds

ASTM-D1151 - 2000 R22 EDITION - CURRENT
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Standard Practice for Effect of Moisture and Temperature on Adhesive Bonds
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Scope

1.1 This practice defines conditions for determining the performance of adhesive bonds when subjected to continuous exposure at specified conditions of moisture and temperature. The performance is expressed as a percentage based on the ratio of strength retained after exposure to the original strength.

1.2 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information purposes only.

1.3 This standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Keywords

adhesive bonds; moisture; temperature; ICS Number Code 83.180 (Adhesives)

To find similar documents by ASTM Volume:

15.06 (Adhesives)

To find similar documents by classification:

83.180 (Adhesives Including adhesive tapes Adhesive tapes for electrical insulation purposes, see 29.035.20)

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Document Number

ASTM-D1151-00R22

Revision Level

2000 R22 EDITION

Status

Current

Modification Type

Revision

Publication Date

Jan. 20, 2022

Document Type

Practice

Page Count

3 pages

Committee Number

D14.80