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Scope

1.1 This document provides guidelines for installing bonded resistance strain gages. It is not intended to be used for bulk or diffused semiconductor gages. This document pertains only to adhesively bonded strain gages.

1.2 This standard does not purport to address all of the safety problems, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Keywords

Adhesion; Adhesive bonding; Base-metal substrates; Bonded resistance strain gages; Bonding; Bond strength; Electrical measurements; Environmental control/fate; Etched foil resistance strain gages; Expansion; Heating tests-metals; Installation; Resistance; Resistance gages; Solder/soldering applications; Strain gages; Strain testing-metallic materials; Stress-metallic materials; Thermal coefficient of expansion; Verification; installing bonded resistance strain gages, guide; ICS Number Code 19.060 (Mechanical testing)

To find similar documents by ASTM Volume:

03.01 (Metals -- Mechanical Testing; Elevated and Low-Temperature Tests; Metallography)

To find similar documents by classification:

19.060 (Mechanical testing Including testing equipment Mechanical testing of metals, see 77.040.10)

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