BS-EN-61190-1-3 › Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

BS-EN-61190-1-3 - 2007 EDITION AMENDMENT 1 - SUPERSEDED
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Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Keywords

Quality control;Particulate materials;Quality assurance;Electronic engineering;Soldering;Fluxes (materials);Electrical connections;Solders;Bonding;Bars (materials);Electronic equipment and components

To find similar documents by classification:

31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

BS-EN-61190-1-3

Revision Level

2007 EDITION AMENDMENT 1

Status

Superseded

Publication Date

March 1, 2011

International Equivalent

EN 61190-1-3 (IEC 61190-1-3:2002 AS);IEC 61190-1-3:2002

Committee Number

EPL/501