BS-EN-61760-3 › Surface mounting technology

BS-EN-61760-3 - 2010 EDITION - SUPERSEDED
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Surface mounting technology

Keywords

Marking;Packaging;Surface mounting devices;Soldering;Electronic equipment and components;Cleaning;Integrated circuit technology;Solderability testing;Microassembling;Electrical components;Holes;Integrated circuits

To find similar documents by classification:

31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

BS EN 61760-3:2010

Revision Level

2010 EDITION

Status

Superseded

Publication Date

June 30, 2010

Replaced By

BS EN IEC 61760-3:2021

Page Count

28

ISBN

9780580639296

International Equivalent

EN 61760-3:2010;IEC 61760-3:2010

Committee Number

EPL/501