DIN-EN-62137-4 › Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015
DIN-EN-62137-4
-
2015 EDITION
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CURRENT
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015
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Document Number
DIN EN 62137-4:2015-07
Revision Level
2015 EDITION
Status
Current
Publication Date
July 1, 2015