EN-62047-13 › Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures

EN-62047-13 - 2012 EDITION - CURRENT -- See the following: BS-EN-62047-13



Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures


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Document Number

EN 62047-13:2012

Revision Level

2012 EDITION

Status

Current

Publication Date

April 6, 2012