EN-62739-1 › Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
To find similar documents by classification:
31.190 (Electronic component assemblies Including preassembled modules)
31.240 (Mechanical structures for electronic equipment)
Document Number
EN 62739-1:2013
Revision Level
2013 EDITION
Status
Current
Publication Date
Aug. 30, 2013