EN-IEC-61190-1-3 › Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
EN-IEC-61190-1-3
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2018 EDITION
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CURRENT
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
To find similar documents by classification:
31.190 (Electronic component assemblies Including preassembled modules)
Document Number
EN IEC 61190-1-3
Revision Level
2018 EDITION
Status
Current
Publication Date
March 9, 2018