IEC-60068-2-58 › Complete Document History
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Complete Current Edition:
   EDITION 4.1 - CONSOLIDATES AMENDMENT 1 - July 1, 2017

Obsolete Revision Information:
   FOR ED. 4.0 AMENDMENT 1 SEE - IEC-60068-2-58-AM1 - July 1, 2017
   EDITION 4.0 - Part 2-58: Tests - Test Td: Test methods for solderability, - March 27, 2015
   3RD EDITION - Part 2-58: Tests - Test Td: Test methods for solderability, - July 1, 2004
   EDITION 2.0 - Part 2-58: Tests - Test Td: Test methods for solderability, - Jan. 1, 1999