IEC-60749-19-AM1 Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

IEC-60749-19-AM1 - 1ST EDITION AMENDMENT 1 - SUPERSEDED
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Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

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Document Number

IEC 60749-19 Amd.1 Ed. 1.0 b:2010

Revision Level

1ST EDITION AMENDMENT 1

Status

Superseded

Publication Date

July 1, 2010

Committee Number

47