IEC-61191-2 › Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
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Included in this current edition are the following subparts:
EDITION 3.0 - May 1, 2017
ED. 3.0 CORRIGENDUM 1 - Sept. 1, 2019
ED. 3.0 CORRIGENDUM 1 - Sept. 1, 2019
IEC 61191-2:2017(E) gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
This edition includes the following significant technical changes with respect to the previous edition:
a) the requirements have been updated to be compliant with the acceptance criteria in IPC A-610F;
b) some of the terminology used in the document has been updated;
c) references to IEC standards have been corrected;
d) five termination styles have been added.
To find similar documents by classification:
31.190 (Electronic component assemblies Including preassembled modules)
31.240 (Mechanical structures for electronic equipment)
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Document Number
IEC 61191-2 Ed. 3.0 en:2017
Revision Level
EDITION 3.0
Status
Current
Publication Date
May 1, 2017
Committee Number
91