IEC-61192-3 › Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
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Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
To find similar documents by classification:
31.190 (Electronic component assemblies Including preassembled modules)
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Document Number
IEC 61192-3 Ed. 1.0 b:2002
Revision Level
EDITION 1.0
Status
Superseded
Publication Date
Dec. 1, 2002
Committee Number
91