IEC-61193-1 › Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
IEC-61193-1
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1ST EDITION
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CURRENT
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Defines methods of registration and analysis of defects on soldered printed board assemblies. These methods are described to allow effective comparison of performance between products, processes and production locations, and can serve as a basis for general quality improvement.
To find similar documents by classification:
31.190 (Electronic component assemblies Including preassembled modules)
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Document Number
IEC 61193-1 Ed. 1.0 b:2001
Revision Level
1ST EDITION
Status
Current
Publication Date
Dec. 1, 2001
Committee Number
91