IEC-61760-3-1 › Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering . Guidelines for through hole diameter design with solder paste surface printing method
IEC-61760-3-1
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EDITION 1.0
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CURRENT
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IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.
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31.190 (Electronic component assemblies Including preassembled modules)
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Document Number
IEC/TR 61760-3-1 Ed. 1.0 en:2022
Revision Level
EDITION 1.0
Status
Current
Publication Date
June 1, 2022
Committee Number
91