IEC-61760-5-1 › Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
IEC-61760-5-1
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EDITION 1.0
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CURRENT
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IEC TR 61760-5-1:2024 describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called .bending cracks.. Area-array components are excluded from the scope of this document.
To find similar documents by classification:
31.190 (Electronic component assemblies Including preassembled modules)
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Document Number
IEC/TR 61760-5-1 Ed. 1.0 en:2024
Revision Level
EDITION 1.0
Status
Current
Publication Date
Jan. 1, 2024
Committee Number
91