IEC-62137-1-2 › Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
IEC-62137-1-2
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1ST EDITION
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CURRENT
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The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.
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Document Number
IEC 62137-1-2 Ed. 1.0 b:2007
Revision Level
1ST EDITION
Status
Current
Publication Date
July 1, 2007
Committee Number
91