IEC-62647-4 › Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling
IEC-62647-4
-
EDITION 1.0
-
CURRENT
Document Center Inc. is an authorized dealer of IEC standards.
The following bibliographic material is provided to assist you with your purchasing decision:
The following bibliographic material is provided to assist you with your purchasing decision:
IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining a new set of processes or the creation of a stand-alone re-balling process.
To find similar documents by classification:
03.100.50 (Production. Production management)
This document comes with our free Notification Service, good for the life of the document.
This document is available in either Paper or PDF format.
Customers who bought this document also bought:
MIL-STD-202Test Method Standard for Electronic and Electrical Component Parts
JEDEC-J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
MIL-STD-130
Identification Marking of U.S. Military Property
Document Number
IEC/TS 62647-4 Ed. 1.0 en:2018
Revision Level
EDITION 1.0
Status
Current
Publication Date
April 1, 2018
Committee Number
107