IPC-A-610 Acceptability of Electronic Assemblies (Hardcopy Format)

IPC-A-610 - REVISION E - CURRENT
Show Complete Document History

This document is also known as: IPC-A-610E


Acceptability of Electronic Assemblies (Hardcopy Format)

Abstract

IPC-A-610 is the most widely used electronics assembly standard in the world. A must for all quality assurance and assembly departments, IPC-A-610E illustrates industry-accepted workmanship criteria for electronics assemblies through full-color photographs and illustrations. Topics include flex attachment, board in board, part on part, lead free, component orientation and soldering criteria for through-hole, SMT (new termination styles) and discrete wiring assemblies, mechanical assembly, cleaning, marking, coating, and laminate requirements.

IPC-A-610 is invaluable for all inspectors, operators and trainers. Revision E has 809 photos and illustrations of acceptability criteria-165 of them new or updated. This revision has been critically reviewed for clarity and accuracy. The document synchronizes to the requirements expressed in other industry consensus documents and is used with the material and process standard IPC J-STD-001.

The IEC is in the process of endorsing IPC-A-610 as the globally preferred international acceptance standard for electronics assembly.  Already adopted by the DoD.

Notes

Claudia's Notes:
IPC-A-610, "Acceptability of Electronic Assemblies," remains the perennial Top Quality Standard for electronic assembly facilities world-wide.  Commonly used with IPC/EIA-J-STD-001, "Requirements for Soldered Electrical and Electronic Assemblies," the two documents were brought into closer alignment with the simultaneous release of new editions for both documents.


To find similar documents by Federal Supply Class Code:

FSC Standardization Area SOLD (Soldering)

This document comes with our free Notification Service, good for the life of the document.

This document is available in Paper format.

ORDER

Price:

$136.00




Document Number

IPC-A-610

Revision Level

REVISION E

Status

Current

Publication Date

April 15, 2010