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ISO/TS 10303-1620:2006 specifies the application module for AP210 interconnect physical requirements.

ISO/TS 10303-1620:2006 deals with the representation of interconnect physical requirements. This data includes all information related to shape and position requirements. Trace, via and other passage spacing, keepin, keepout, etc. is included. Explicit allowed volumetric shape, required connection locations, material specifications, etc. are included. Those layout items whose placement is driven by thermal considerations or electromagnetic interference may be specified. Configuration management information and design change management information is provided. This data includes at least one geometric representation.

The following are within the scope of ISO/TS 10303-1620:2006:

• shape based requirements allocated to interconnect design;
• location requirements allocated to component in an interconnect design;
• grouping requirements allocated to component in an interconnect design;
• keepin requirements allocated to component categories in an interconnect design;
• keepout requirements allocated to component categories in an interconnect design;
• location requirements allocated to feature in an interconnect design;
• grouping requirements allocated to feature in an interconnect design;
• keepin requirements allocated to feature categories in an interconnect design;
• keepout requirements allocated to feature categories in an interconnect design;
• keepin areas;
• keepout areas.