MIL-PRF-31032/2 › Complete Document History
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
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REVISION D/AM 1 - REVISION D WITH AMENDMENT 1 INTERFILED - July 22, 2022
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Obsolete Revision Information: |
REVISION D - Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-Through Holes, for Soldered Part Mounting - March 2, 2020
REVISION C/AM 1 - REVISION C WITH AMENDMENT 1 INTERFILED - June 12, 2018
REVISION C - Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting - June 2, 2017
REVISION B/AM 1 - REVISION B/AMENDMENT 1 INTERFILED - Nov. 2, 2012
REVISION B - PRINTED WIRING BOARD, RIGID, SINGLE & DOUBLE LAYER, THERMOSE - June 14, 2010
REVISION A/AM 4 - REV A/AMENDMENT 4 INTERFILED - July 4, 2009
REVISION A/AM 3 - REV A/AMENDMENT 3 INTERFILED - April 23, 2008
REVISION A/AM 2 - REV A/AMENDMENT 2 INTERFILED - Oct. 31, 2006
REVISION A/AM 1 - REV A/AMENDMENT 1 INTERFILED - Feb. 24, 2006
REVISION A - WITH OR WITHOUT PLATED THROUGH - Oct. 29, 2004
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