MIL-PRF-31032/5 Historical Revision Information
Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated-Through Holes, for High Frequency Applications

MIL-PRF-31032/5 - REVISION C/AM 2 - CURRENT
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Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications


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FSC 5998 (Electrical and Electronic assemblies, Boards, Cards, and Associated Hardware)

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Document Number

MIL-PRF-31032/5C(2)

Revision Level

REVISION C/AM 2

Status

Current

Publication Date

Sept. 15, 2022

Page Count

56 pages