MIL-PRF-31032/6 › Complete Document History
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
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REVISION C/AM 1 - REVISION C WITH AMENDMENT 1 INTERFILED - Sept. 16, 2022
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Obsolete Revision Information: |
REVISION C - Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic or Thermosetting Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications - May 6, 2020
REVISION B - Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications - Oct. 6, 2017
REVISION A - Material, with or without Plated-Through Holes, for High Fre - Dec. 11, 2012
BASE/AM 1 - BASE/AMENDMENT 1 INTERFILED - April 10, 2009
BASE - WITH OR WITHOUT PLATED-THROUGH HOSES, FOR HIGH FREQUENCY APP - March 11, 2008
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