PD-IEC-61760-5-1 › Surface mounting technology
PD-IEC-61760-5-1
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2024 EDITION
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CURRENT
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Surface mounting technology
Keywords
Circuits;Integrated circuits;Surface mounting devices;Strain;Printed-circuit boards;Strain gauges;Strain measurement;Microprocessor chips;Components
To find similar documents by classification:
31.190 (Electronic component assemblies Including preassembled modules)
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Document Number
PD IEC TR 61760-5-1:2024
Revision Level
2024 EDITION
Status
Current
Publication Date
Feb. 7, 2024
Page Count
28
ISBN
9780539250992
International Equivalent
IEC/TR 61760-5-1 ED1
Committee Number
EPL/501