10.04: Electronics; Declarable Substances in Materials; 3D Imaging Systems
ASTM International (formerly the American Society for Testing and Materials) has published a complete collection of their standards for some time. This collection is divided into Sections and Volumes by subject classification for increased useability.
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The following documents are a part of this series:
- ASTM-52900 - Additive manufacturing — General principles — Fundamentals and vocabulary
- ASTM-52915 - Specification for additive manufacturing file format (AMF) Version 1.2
- ASTM-52921 - Standard Terminology for Additive Manufacturing-Coordinate Systems and Test Methodologies
- ASTM-52922 - Guide for Additive Manufacturing — Design — Directed Energy Deposition
- ASTM-D8558 - Standard Guide for Verification of a Certificate of Authentication Used to Track Products through Their Supply Chain by Utilizing Blockchain Technology
- ASTM-E1392 - Standard Practice for Angle Resolved Optical Scatter Measurements on Specular or Diffuse Surfaces (Withdrawn 2003)
- ASTM-E2544 - Standard Terminology for Three-Dimensional (3D) Imaging Systems
- ASTM-E2641 - Standard Practice for Best Practices for Safe Application of 3D Imaging Technology
- ASTM-E2807 - Standard Specification for 3D Imaging Data Exchange, Version 1.0
- ASTM-E2919 - Standard Test Method for Evaluating the Performance of Systems that Measure Static, Six Degrees of Freedom (6DOF), Pose
- ASTM-E2938 - Standard Test Method for Evaluating the Relative-Range Measurement Performance of 3D Imaging Systems in the Medium Range
- ASTM-E3064 - Standard Test Method for Evaluating the Performance of Optical Tracking Systems that Measure Six Degrees of Freedom (6DOF) Pose (Withdrawn 2025)
- ASTM-E3124 - Standard Test Method for Measuring System Latency Performance of Optical Tracking Systems that Measure Six Degrees of Freedom (6DOF) Pose
- ASTM-E3125 - Standard Test Method for Evaluating the Point-to-Point Distance Measurement Performance of Spherical Coordinate 3D Imaging Systems in the Medium Range
- ASTM-F1 - Standard Specification for Nickel-Clad and Nickel-Plated Steel Strip for Electron Tubes (Withdrawn 2009)
- ASTM-F1032 - Guide for Measuring Time-Dependant Total-Dose Effects in Semiconductor Devices Exposed to Pulsed Ionizing Radiation (Withdrawn 1994)
- ASTM-F1048 - Standard Test Method for Measuring the Effective Surface Roughness of Optical Components by Total Integrated Scattering (Withdrawn 2003)
- ASTM-F1049 - Standard Practice for Shallow Etch Pit Detection on Silicon Wafers (Withdrawn 2003
- ASTM-F106 - Standard Specification for Brazing Filler Metals for Electron Devices (Withdrawn 2024)
- ASTM-F1094 - Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method
- ASTM-F1096 - Method for Measuring Mosfet Saturated Threshold Voltage (Withdrawn 1992)
- ASTM-F110 - Standard Test Method for Thickness of Epitaxial or Diffused Layers in Silicon by the Angle Lapping and Staining Technique (Withdrawn 2003)
- ASTM-F111 - Standard Practice for Determining Barium Yield, Getter Gas Content, and Getter Sorption Capacity for Barium Flash Getters
- ASTM-F1152 - Standard Test Method for Dimensions of Notches on Silicon Wafers (Withdrawn 2003)
- ASTM-F1153 - Standard Test Method for Characterization of Metal-Oxide-Silicon (MOS) Structures by Capacitance-Voltage Measurements (Withdrawn 2003)
- ASTM-F1188 - Standard Test Method for Interstitial Atomic Oxygen Content of Silicon by Infrared Absorption with Short Baseline (Withdrawn 2003)
- ASTM-F1190 - Standard Guide for Neutron Irradiation of Unbiased Electronic Components
- ASTM-F1191 - Guide for the Radiation Testing of Semiconductor Memories (Withdrawn 1993)
- ASTM-F1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices
- ASTM-F1211 - Standard Specification for Semiconductor Device Passivation Opening Layouts
- ASTM-F1212 - Standard Test Method for Thermal Stability Testing of Gallium Arsenide Wafers
- ASTM-F1226 - Standard Test Method for Calibration of Liquid-Borne Particle Counters for Submicrometer Particle Sizing (Withdrawn 2002)
- ASTM-F1238 - Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
- ASTM-F1239 - Standard Test Methods for Oxygen Precipitation Characterization of Silicon Wafers by Measurement of Interstitial Oxygen Reduction (Withdrawn 2003)
- ASTM-F1241 - Standard Terminology of Silicon Technology (Withdrawn 2003)
- ASTM-F1259M - Standard Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure Due to Electromigration [Metric] (Withdrawn 2009)
- ASTM-F1260M - Standard Test Method for Estimating Electromigration Median Time-to-Failure and Sigma of Integrated Circuit Metallizations [Metric] (Withdrawn 2009)
- ASTM-F1261M - Standard Test Method for Determining the Average Electrical Width of a Straight, Thin-Film Metal Line [Metric] (Withdrawn 2009)
- ASTM-F1262M - Standard Guide for Transient Radiation Upset Threshold Testing of Digital Integrated Circuits (Metric) (Withdrawn 2023)
- ASTM-F1263 - Standard Guide for Analysis of Overtest Data in Radiation Testing of Electronic Parts
- ASTM-F1269 - Standard Test Methods for Destructive Shear Testing of Ball Bonds (Withdrawn 2023)
- ASTM-F128 - Methods of Testing Sleeves and Tubing for Electron Tube Cathodes (Withdrawn 1991)
- ASTM-F1340 - Test Method for Determining the Mean Interface Trap Density of Mosfets by Charge-Pumping (Withdrawn 1997)
- ASTM-F1366 - Standard Test Method for Measuring Oxygen Concentration in Heavily Doped Silicon Substrates by Secondary Ion Mass Spectrometry (Withdrawn 2003)
- ASTM-F1367 - Standard Specification for Chromium Sputtering Targets for Thin Film Applications
- ASTM-F1372 - Standard Test Method for Scanning Electron Microscope (SEM) Analysis of Metallic Surface Condition for Gas Distribution System Components
- ASTM-F1373 - Standard Test Method for Determination of Cycle Life of Automatic Valves for Gas Distribution System Components
- ASTM-F1374 - Standard Test Method for Ionic/Organic Extractables of Internal Surfaces-IC/GC/FTIR for Gas Distribution System Components
- ASTM-F1375 - Standard Test Method for Energy Dispersive X-Ray Spectrometer (EDX) Analysis of Metallic Surface Condition for Gas Distribution System Components
- ASTM-F1376 - Standard Guide for Metallurgical Analysis for Gas Distribution System Components
- ASTM-F1388 - Standard Test Method for Generation Lifetime and Generation Velocity of Silicon Material by Capacitance-Time Measurements of Metal-Oxide-Silicon (MOS) Capacitors (Withdrawn 2003)
- ASTM-F1389 - Standard Test Methods for Photoluminescence Analysis of Single Crystal Silicon for III-V Impurities (Withdrawn 2003)
- ASTM-F1390 - Standard Test Method for Measuring Warp on Silicon Wafers by Automated Noncontact Scanning (Withdrawn 2003)
- ASTM-F1391 - Standard Test Method for Substitutional Atomic Carbon Content of Silicon by Infrared Absorption (Withdrawn 2003)
- ASTM-F1392 - Standard Test Method for Determining Net Carrier Density Profiles in Silicon Wafers by Capacitance-Voltage Measurements With a Mercury Probe (Withdrawn 2003)
- ASTM-F1393 - Standard Test Method for Determining Net Carrier Density in Silicon Wafers by Miller Feedback Profiler Measurements With a Mercury Probe (Withdrawn 2003)
- ASTM-F1394 - Standard Test Method for Determination of Particle Contribution from Gas Distribution System Valves
- ASTM-F1396 - Standard Test Method for Determination of Oxygen Contribution by Gas Distribution System Components
- ASTM-F1397 - Standard Test Method for Determination of Moisture Contribution by Gas Distribution System Components
- ASTM-F1398 - Standard Test Method for Determination of Total Hydrocarbon Contribution by Gas Distribution System Components
- ASTM-F1404 - Test Method for Crystallographic Perfection of Gallium Arsenide by Molten Potassium Hydroxide (KOH) Etch Technique (Withdrawn 2016)
- ASTM-F1438 - Standard Test Method for Determination of Surface Roughness by Scanning Tunneling Microscopy for Gas Distribution System Components
- ASTM-F1451 - Standard Test Method for Measuring Sori on Silicon Wafers by Automated Noncontact Scanning (Withdrawn 2003)
- ASTM-F1466 - Standard Specification for Iron-Nickel-Cobalt Alloys for Metal-to-Ceramic Sealing Applications
- ASTM-F1467 - Standard Guide for Use of an X-Ray Tester (≈10 keV Photons) in Ionizing Radiation Effects Testing of Semiconductor Devices and Microcircuits
- ASTM-F15 - Standard Specification for Iron-Nickel-Cobalt Sealing Alloy
- ASTM-F1512 - Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies
- ASTM-F1513 - Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications
- ASTM-F1526 - Standard Test Method for Measuring Surface Metal Contamination on Silicon Wafers by Total Reflection X-Ray Fluorescence Spectroscopy (Withdrawn 2003)
- ASTM-F1527 - Standard Guide for Application of Certified Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon (Withdrawn 2003)
- ASTM-F1528 - Standard Test Method for Measuring Boron Contamination in Heavily Doped N-Type Silicon Substrates by Secondary Ion Mass Spectrometry (Withdrawn 2003)
- ASTM-F1529 - Standard Test Method for Sheet Resistance Uniformity Evaluation by In-Line Four-Point Probe with the Dual-Configuration Procedure
- ASTM-F1530 - Standard Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Noncontact Scanning (Withdrawn 2003)
- ASTM-F1535 - Standard Test Method for Carrier Recombination Lifetime in Silicon Wafers by Noncontact Measurement of Photoconductivity Decay by Microwave Reflectance (Withdrawn 2003)
- ASTM-F154 - Standard Guide for Identification of Structures and Contaminants Seen on Specular Silicon Surfaces (Withdrawn 2003)
- ASTM-F1569 - Standard Guide for Generation of Consensus Reference Materials for Semiconductor Technology (Withdrawn 2003)
- ASTM-F1570 - Standard Test Method for Determining the Tactile Ratio of a Membrane Switch (Withdrawn 2007)
- ASTM-F1578 - Standard Test Method for Contact Closure Cycling of a Membrane Switch
- ASTM-F1593 - Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer (Withdrawn 2023)
- ASTM-F1594 - Standard Specification for Pure Aluminum (Unalloyed) Source Material for Vacuum Coating Applications
- ASTM-F1595 - Standard Practice for Viewing Conditions for Visual Inspection of Membrane Switches
- ASTM-F1596 - Standard Test Method for Exposure of a Membrane Switch or Printed Electronic Device to Temperature and Relative Humidity (Withdrawn 2024)
- ASTM-F1597 - Standard Test Method for Determining the Actuation Force and Contact Force of a Membrane Switch (Withdrawn 2008)
- ASTM-F1598 - Standard Test Method for Determining the Effects of Chemical/Solvent Exposure to a Membrane Switch/Graphic Overlay (Spot Test Method) (Withdrawn 2023)
- ASTM-F16 - Standard Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps
- ASTM-F1617 - Standard Test Method for Measuring Surface Sodium, Aluminum, Potassium, and Iron on Silicon and EPI Substrates by Secondary Ion Mass Spectrometry (Withdrawn 2003)
- ASTM-F1618 - Standard Practice for Determination of Uniformity of Thin Films on Silicon Wafers (Withdrawn 2003)
- ASTM-F1619 - Standard Test Method for Measurement of Interstitial Oxygen Content of Silicon Wafers by Infrared Absorption Spectroscopy with p-Polarized Radiation Incident at the Brewster Angle (Withdrawn 2003)
- ASTM-F1620 - Standard Practice for Calibrating a Scanning Surface Inspection System Using Monodisperse Polystyrene Latex Spheres Deposited on Polished or Epitaxial Wafer Surfaces (Withdrawn 2003)
- ASTM-F1621 - Standard Practice for Determining the Positional Accuracy Capabilities of a Scanning Surface Inspection System (Withdrawn 2003)
- ASTM-F1630 - Standard Test Method for Low Temperature FT-IR Analysis of Single Crystal Silicon for III-V Impurities (Withdrawn 2003)
- ASTM-F1661 - Standard Test Method for Determining the Contact Bounce Time of a Membrane Switch (Withdrawn 2024)
- ASTM-F1662 - Standard Test Method for Verifying the Specified Dielectric Withstand Voltage and Determining the Dielectric Breakdown Voltage of a Membrane Switch or Printed Electronic Device (Withdrawn 2023)
- ASTM-F1663 - Standard Test Method for Determining the Capacitance of a Membrane Switch or Printed Electronic Device (Withdrawn 2024)
- ASTM-F1680 - Standard Test Method for Determining Circuit Resistance of a Membrane Switch (Withdrawn 2023)
- ASTM-F1681 - Standard Test Method for Determining Current Carrying Capacity of a Membrane Switch Circuit (Withdrawn 2023)
- ASTM-F1682 - Standard Test Method for Determining Travel of a Membrane Switch (Withdrawn 2008)
- ASTM-F1683 - Standard Practice for Creasing or Bending a Membrane Switch, Membrane Switch Flex Tail Assembly or Membrane Switch Component (Withdrawn 2018)
- ASTM-F1684 - Standard Specification for Iron-Nickel and Iron-Nickel-Cobalt Alloys for Low Thermal Expansion Applications
- ASTM-F1689 - Standard Test Method for Determining the Insulation Resistance of a Membrane Switch
- ASTM-F1708 - Standard Practice for Evaluation of Granular Polysilicon by Meter-Zoner Spectroscopies (Withdrawn 2003)
- ASTM-F1709 - Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications (Withdrawn 2023)
- ASTM-F1710 - Standard Test Method for Trace Metallic Impurities in Electronic Grade Titanium by High Mass-Resolution Glow Discharge Mass Spectrometer (Withdrawn 2023)
- ASTM-F1711 - Standard Practice for Measuring Sheet Resistance of Thin Film Conductors for Flat Panel Display Manufacturing Using a Four-Point Probe Method (Withdrawn 2023)
- ASTM-F1723 - Standard Practice for Evaluation of Polycrystalline Silicon Rods by Float-Zone Crystal Growth and Spectroscopy (Withdrawn 2003)
- ASTM-F1724 - Standard Test Method for Measuring Surface Metal Contamination of Polycrystalline Silicon by Acid Extraction-Atomic Absorption Spectroscopy (Withdrawn 2003)
- ASTM-F1725 - Standard Guide for Analysis of Crystallographic Perfection of Silicon Ingots (Withdrawn 2003)
- ASTM-F1726 - Standard Guide for Analyis of Crystallographic Perfection of Silicon Wafers (Withdrawn 2003)
- ASTM-F1727 - Standard Practice for Detection of Oxidation Induced Defects in Polished Silicon Wafers (Withdrawn 2003)
- ASTM-F1761 - Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets
- ASTM-F1762 - Standard Test Method for Determining the Effects of Atmospheric Pressure Variation on a Membrane Switch (Withdrawn 2023)
- ASTM-F1763 - Standard Test Methods for Measuring Contrast of a Linear Polarizer (Withdrawn 2003)
- ASTM-F1771 - Standard Test Method for Evaluating Gate Oxide Integrity by Voltage Ramp Technique (Withdrawn 2003)
- ASTM-F18 - Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices
- ASTM-F180 - Standard Test Method for Density of Fine Wire and Ribbon Wire for Electronic Devices
- ASTM-F1809 - Standard Guide for Selection and Use of Etching Solutions to Delineate Structural Defects in Silicon (Withdrawn 2003)
- ASTM-F1810 - Standard Test Method for Counting Preferentially Etched or Decorated Surface Defects in Silicon Wafers (Withdrawn 2003)
- ASTM-F1811 - Standard Practice for Estimating the Power Spectral Density Function and Related Finish Parameters from Surface Profile Data (Withdrawn 2003)
- ASTM-F1812 - Standard Test Method for Determining the Effect of an ESD Discharge on a Membrane Switch or Printed Electronic Device (Withdrawn 2024)
- ASTM-F1842 - Standard Test Method for Determining Ink or Coating Adhesion on Flexible Substrates for a Membrane Switch or Printed Electronic Device (Withdrawn 2024)
- ASTM-F1843 - Standard Practice for Sample Preparation of Plastic Films used on Membrane Switch Overlays for Specular Gloss Measurements (Withdrawn 2024)
- ASTM-F1844 - Standard Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage (Withdrawn 2023)
- ASTM-F1845 - Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum-Copper, Aluminum-Silicon, and Aluminum-Copper-Silicon Alloys by High-Mass-Resolution Glow Discharge Mass Spectrometer (Withdrawn 2023)
- ASTM-F1892 - Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices
- ASTM-F1893 - Guide for Measurement of Ionizing Dose-Rate Survivability and Burnout of Semiconductor Devices (Withdrawn 2023)
- ASTM-F1894 - Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness
- ASTM-F1895 - Standard Test Method for Submersion of a Membrane Switch (Withdrawn 2023)
- ASTM-F1896 - Test Method for Determining the Electrical Resistivity of a Printed Conductive Material (Withdrawn 2023)
- ASTM-F19 - Standard Test Method for Tension and Vacuum Testing Metallized Ceramic Seals
- ASTM-F1982 - Standard Test Methods for Analyzing Organic Contaminants on Silicon Wafer Surfaces by Thermal Desorption Gas Chromatography (Withdrawn 2003)
- ASTM-F1995 - Standard Test Method for Determining the Shear Strength of the Bond between a Surface Mount Device (SMD) and Substrate in a Membrane Switch
- ASTM-F1996 - Standard Test Method for Silver Migration for Membrane Switch Circuitry (Withdrawn 2023)
- ASTM-F1997 - Standard Test Method for Determining the Sensitivity (Teasing) of a Tactile Membrane Switch (Withdrawn 2008)
- ASTM-F204 - Standard Test Method for Surface Flaws in Tungsten Seal Rod and Wire
- ASTM-F205 - Standard Test Method for Measuring Diameter of Fine Wire by Weighing
- ASTM-F2072 - Standard Test Method for Hosedown of a Membrane Switch (Withdrawn 2023)
- ASTM-F2073 - Standard Test Method for Non-Destructive Short Circuit Testing of a Membrane Switch (Withdrawn 2023)
- ASTM-F2074 - Standard Guide for Measuring Diameter of Silicon and Other Semiconductor Wafers (Withdrawn 2003)
- ASTM-F2086 - Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets, Method 2 (Withdrawn 2007)
- ASTM-F2112 - Standard Terminology for Membrane Switches
- ASTM-F2113 - Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications
- ASTM-F2114 - Standard Guide for ASTM Standard Test Methods, Standard Practices, and Typical Values of a Membrane Switch (Withdrawn 2009)
- ASTM-F2139 - Standard Test Method for Measuring Nitrogen Concentration in Silicon Substrates by Secondary Ion Mass Spectrometry (Withdrawn 2003)
- ASTM-F2166 - Standard Practices for Monitoring Non-Contact Dielectric Characterization Systems Through Use of Special Reference Wafers (Withdrawn 2003)
- ASTM-F2187 - Standard Test Method for Determining the Effect of Random Frequency Vibration on a Membrane Switch or Membrane Switch Assembly
- ASTM-F2188 - Standard Test Method for Determining the Effect of Variable Frequency Vibration on a Membrane Switch or Membrane Switch Assembly
- ASTM-F219 - Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps (Withdrawn 2023)
- ASTM-F2357 - Standard Test Method for Determining the Abrasion Resistance of Inks and Coatings on Membrane Switches Using the Norman Tool "RCA" Abrader (Withdrawn 2017)
- ASTM-F2358 - Standard Guide for Measuring Characteristics of Sapphire Substrates
- ASTM-F2359 - Standard Test Method for Determining Color of a Membrane Switch Backlit with Diffuse Light Source
- ASTM-F2360 - Standard Test Method for Determining Luminance of a Membrane Switch Backlit with Diffuse Light Source (Withdrawn 2024)
- ASTM-F2405 - Standard Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer
- ASTM-F256 - Standard Specification for Chromium-Iron Sealing Alloys with 18 or 28 Percent Chromium
- ASTM-F2576 - Standard Terminology Relating to Declarable Substances in Materials (Withdrawn 2024)
- ASTM-F2577 - Standard Guide for Compositional Evaluation of Declarable Substances and Substances of Concern for Materials in Products
- ASTM-F2592 - Standard Test Method for Measuring the Force-Displacement of a Membrane Switch (Withdrawn 2023)
- ASTM-F26 - Standard Test Methods for Determining the Orientation of a Semiconductive Single Crystal (Withdrawn 2003)
- ASTM-F2617 - Standard Test Method for Identification and Quantification of Chromium, Bromine, Cadmium, Mercury, and Lead in Polymeric Material Using Energy Dispersive X-ray Spectrometry
- ASTM-F269 - Standard Test Method for Sag of Tungsten Wire
- ASTM-F2725 - Standard Guide for European Union's Registration, Evaluation, and Authorization of Chemicals (REACH) Supply Chain Information Exchange
- ASTM-F2749 - Standard Test Method for Determining the Effects of Creasing a Membrane Switch or Printed Electronic Device (Withdrawn 2024)
- ASTM-F2750 - Standard Test Method for Determining the Effects of Bending a Membrane Switch or Printed Electronic Device (Withdrawn 2023)
- ASTM-F2771 - Standard Test Method for Determining the Luminance Curve of an Electroluminescent Lamp at Ambient Conditions (Withdrawn 2023)
- ASTM-F2792 - Standard Terminology for Additive Manufacturing Technologies,
- ASTM-F28 - Standard Test Methods for Minority-Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay (Withdrawn 2003)
- ASTM-F2853 - Standard Test Method for Determination of Lead in Paint Layers and Similar Coatings or in Substrates and Homogenous Materials by Energy Dispersive X-Ray Fluorescence Spectrometry Using Multiple Monochromatic Excitation Beams
- ASTM-F2865 - Standard Guide for Classifying the Degrees of Ingress of Dust and Water into a Membrane Switch
- ASTM-F2866 - Standard Test Method for Flammability of a Membrane Switch in Defined Assembly
- ASTM-F288 - Standard Specification for Tungsten Wire for Electron Devices and Lamps
- ASTM-F289 - Standard Specification for Molybdenum Wire and Rod for Electronic Applications
- ASTM-F29 - Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications
- ASTM-F290 - Standard Specification for Round Wire for Winding Electron Tube Grid Laterals
- ASTM-F2915 - Standard Specification for Additive Manufacturing File Format (AMF) Version 1.2
- ASTM-F2921 - Standard Terminology for Additive Manufacturing—Coordinate Systems and Test Methodologies (Withdrawn 2013)
- ASTM-F2924 - Standard Specification for Additive Manufacturing Titanium-6 Aluminum-4 Vanadium with Powder Bed Fusion
- ASTM-F2931 - Standard Guide for Analytical Testing of Substances of Very High Concern in Materials and Products
- ASTM-F2964 - Standard Test Method for Determining the Uniformity of the Luminance of an Electroluminescent Lamp or Other Diffuse Lighting Device
- ASTM-F2971 - Standard Practice for Reporting Data for Test Specimens Prepared by Additive Manufacturing
- ASTM-F2980 - Standard Test Method for Analysis of Heavy Metals in Glass by Field Portable X-Ray Fluorescence (XRF)
- ASTM-F3 - Standard Specification for Nickel Strip for Electron Tubes (Withdrawn 2008)
- ASTM-F30 - Standard Specification for Iron-Nickel Sealing Alloys (Withdrawn 2024)
- ASTM-F3001 - Standard Specification for Additive Manufacturing Titanium-6 Aluminum-4 Vanadium ELI (Extra Low Interstitial) with Powder Bed Fusion
- ASTM-F3049 - Standard Guide for Characterizing Properties of Metal Powders Used for Additive Manufacturing Processes
- ASTM-F3055 - Standard Specification for Additive Manufacturing Nickel Alloy (UNS N07718) with Powder Bed Fusion
- ASTM-F3056 - Standard Specification for Additive Manufacturing Nickel Alloy (UNS N06625) with Powder Bed Fusion
- ASTM-F3078 - Standard Test Method for Identification and Quantification of Lead in Paint and Similar Coating Materials using Energy Dispersive X-ray Fluorescence Spectrometry (EDXRF)
- ASTM-F3091 - Standard Specification for Powder Bed Fusion of Plastic Materials
- ASTM-F31 - Standard Specification for Nickel-Chromium-Iron Sealing Alloys
- ASTM-F3122 - Standard Guide for Evaluating Mechanical Properties of Metal Materials Made via Additive Manufacturing Processes
- ASTM-F3139 - Standard Test Method for Analysis of Tin-Based Solder Alloys for Minor and Trace Elements Using Inductively Coupled Plasma Atomic Emission Spectrometry
- ASTM-F3147 - Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend (Withdrawn 2024)
- ASTM-F3152 - Standard Test Method for Determining Abrasion Resistance of Inks and Coatings on Substrates Using Dry or Wet Abrasive Medium (Withdrawn 2023)
- ASTM-F3166 - Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization (Withdrawn 2023)
- ASTM-F3177 - Standard Terminology for Additive Manufacturing – General Principles – Terminology
- ASTM-F3184 - Standard Specification for Additive Manufacturing Stainless Steel Alloy (UNS S31603) with Powder Bed Fusion
- ASTM-F3187 - Standard Guide for Directed Energy Deposition of Metals
- ASTM-F3192 - Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization (Withdrawn 2023)
- ASTM-F3213 - Standard for Additive Manufacturing – Finished Part Properties – Standard Specification for Cobalt-28 Chromium-6 Molybdenum via Powder Bed Fusion
- ASTM-F3290 - Standard Guide for Handling and Application of a Membrane Switch or Printed Electronic Device to its Final Support Structure (Withdrawn 2023)
- ASTM-F3291 - Standard Test Method for Measuring the Force-Resistance of a Membrane Force Sensor (Withdrawn 2023)
- ASTM-F3301 - Standard for Additive Manufacturing – Post Processing Methods – Standard Specification for Thermal Post-Processing Metal Parts Made Via Powder Bed Fusion
- ASTM-F3302 - Standard for Additive Manufacturing – Finished Part Properties – Standard Specification for Titanium Alloys via Powder Bed Fusion
- ASTM-F3303 - Standard for Additive Manufacturing – Process Characteristics and Performance: Practice for Metal Powder Bed Fusion Process to Meet Critical Applications
- ASTM-F3318 - Standard for Additive Manufacturing – Finished Part Properties – Specification for AlSi10Mg with Powder Bed Fusion – Laser Beam
- ASTM-F3413 - Guide for Additive Manufacturing — Design — Directed Energy Deposition
- ASTM-F3434 - Guide for Additive manufacturing – Installation/Operation and Performance Qualification (IQ/OQ/PQ) of Laser-Beam Powder Bed Fusion Equipment for Production Manufacturing
- ASTM-F3456 - Standard Guide for Powder Reuse Schema in Powder Bed Fusion Processes for Medical Applications for Additive Manufacturing Feedstock Materials
- ASTM-F3489 - Standard Guide for Additive Manufacturing of Polymers — Material Extrusion — Recommendation for Material Handling and Evaluation of Static Mechanical Properties
- ASTM-F3490 - Standard Practice for Additive Manufacturing — General Principles — Overview of Data Pedigree
- ASTM-F3522 - Standard Guide for Additive Manufacturing of Metals — Feedstock Materials — Assessment of Powder Spreadability
- ASTM-F3529 - Guide for Additive Manufacturing — Design — Material Extrusion of Polymers
- ASTM-F3530 - Standard Guide for Additive Manufacturing — Design — Post-Processing for Metal PBF-LB
- ASTM-F3554 - Standard Specification for Additive Manufacturing – Finished Part Properties – Grade 4340 (UNS G43400) via Laser Beam Powder Bed Fusion for Transportation Applications
- ASTM-F3560 - Standard Specification for Additive Manufacturing – Data – Common Exchange Format for Particle Size Analysis by Light Scattering
- ASTM-F357 - Standard Practice for Determining Solderability of Thick Film Conductors (Withdrawn 2008)
- ASTM-F3571 - Standard Guide for Additive Manufacturing – Feedstock – Particle Shape Image Analysis by Optical Photography to Identify and Quantify the Agglomerates/Satellites in Metal Powder Feedstock
- ASTM-F3572 - Standard Practice for Additive Manufacturing – General Principles – Part Classifications for Additive Manufactured Parts Used in Aviation
- ASTM-F358 - Standard Test Method for Wavelength of Peak Photoluminescence and the Corresponding Composition of Gallium Arsenide Phosphide Wafers
- ASTM-F3592 - Standard Guide for Additive Manufacturing of Metals – Powder Bed Fusion – Guidelines for Feedstock Re-use and Sampling Strategies
- ASTM-F3604 - Standard Practice for Validating the Additive Manufacturing (AM) Production Process for Medical Devices Produced Using Laser Powder Bed Fusion
- ASTM-F3605 - Standard Guide for Additive Manufacturing of Metals — Data — File Structure for In-Process Monitoring of Powder Bed Fusion (PBF)
- ASTM-F3606 - Standard Guide for Additive Manufacturing — Feedstock Materials — Testing Moisture Content in Powder Feedstock
- ASTM-F3607 - Standard Specification for Additive Manufacturing – Finished Part Properties – Maraging Steel via Powder Bed Fusion
- ASTM-F3615 - Standard Practice for Additive Manufacturing — Powder Bed Fusion — Condition-Defined Maintenance for Optical Systems
- ASTM-F3624 - Standard Guide for Additive Manufacturing of Metals – Powder Bed Fusion – Measurement and Characterization of Surface Texture
- ASTM-F3626 - Standard Guide for Additive Manufacturing — Test Artifacts — Accelerated Build Quality Assurance for Laser Beam Powder Bed Fusion (PBF-LB)
- ASTM-F3635 - Standard Specification for Additive Manufacturing – Finished Part Properties – Standard Specification for Niobium-Hafnium Alloy UNS R04295 via Laser Beam Powder Bed Fusion for Spaceflight Applications
- ASTM-F3637 - Standard Guide for Additive Manufacturing of Metal — Finished Part Properties — Methods for Relative Density Measurement
- ASTM-F364 - Standard Specification for Molybdenum Flattened Wire for Electron Tubes
- ASTM-F374 - Standard Test Method for Sheet Resistance of Silicon Epitaxial, Diffused, Polysilicon, and Ion-implanted Layers Using an In-Line Four-Point Probe with the Single-Configuration Procedure (Withdrawn 2003)
- ASTM-F375 - Standard Specification for Integrated Circuit Lead Frame Material
- ASTM-F390 - Standard Test Method for Sheet Resistance of Thin Metallic Films With a Collinear Four-Probe Array
- ASTM-F391 - Standard Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-State Surface Photovoltage (Withdrawn 2003)
- ASTM-F397 - Standard Test Method for Resistivity of Silicon Bars Using a Two-Point Probe (Withdrawn 2003)
- ASTM-F398 - Standard Test Method for Majority Carrier Concentration in Semiconductors by Measurement of Wavenumber or Wavelength of the Plasma Resonance Minimum (Withdrawn 2003)
- ASTM-F399 - Standard Test Method for Thickness of Heteroepitaxial or Polysilicon Layers (Withdrawn 2002)
- ASTM-F4 - Standard Specification for Carbonized Nickel Strip and Carbonized Nickel-Plated and Nickel-Clad Steel Strip for Electron Tubes (Withdrawn 2010)
- ASTM-F418 - Standard Practice for Preparation of Samples of the Constant Composition Region of Epitaxial Gallium Arsenide Phosphide for Hall Effect Measurements
- ASTM-F419 - Test Method for Determining Carrier Density in Silicon Epitaxial Layers by Capacitance-Voltage Measurements on Fabricated Junction or Schottky Diodes (Withdrawn 2001)
- ASTM-F42 - Standard Test Methods for Conductivity Type of Extrinsic Semiconducting Materials (Withdrawn 2003)
- ASTM-F43 - Standard Test Methods for Resistivity of Semiconductor Materials (Withdrawn 2003)
- ASTM-F44 - Standard Specification for Metallized Surfaces on Ceramic
- ASTM-F448 - Standard Test Method for Measuring Steady-State Primary Photocurrent
- ASTM-F458 - Standard Practice for Nondestructive Pull Testing of Wire Bonds (Withdrawn 2023)
- ASTM-F459 - Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds (Withdrawn 2023)
- ASTM-F48 - Recommended Practices for Dimensioning Mica Bridges (Withdrawn 1984)
- ASTM-F487 - Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding (Withdrawn 2024)
- ASTM-F507 - Practice for Mounting Wedged Beamsplitters to Maintain a Laser Beam Parallel to a Reference Surface (Withdrawn 1994)
- ASTM-F508 - Standard Practice for Specifying Thick-Film Pastes (Withdrawn 2008)
- ASTM-F515 - Specification for Polished Monocrystalline Silicon Slices (Withdrawn 1984)
- ASTM-F517 - Practice for Aligning a Visible Beam From a Continuous-Wave Laser at a Desired Distance From a Reference Surface (Withdrawn 1994)
- ASTM-F523 - Standard Practice for Unaided Visual Inspection of Polished Silicon Wafer Surfaces (Withdrawn 2003)
- ASTM-F524 - Test Methods for Measuring Beam Divergence of Pulsed Lasers by the Apertured-Detector Technique (Withdrawn 2001)
- ASTM-F525 - Standard Test Method for Measuring Resistivity of Silicon Wafers Using a Spreading Resistance Probe (Withdrawn 2003)
- ASTM-F528 - Standard Test Method of Measurement of Common-Emitter D-C Current Gain of Junction Transistors (Withdrawn 2011)
- ASTM-F53 - Recommended Practice for Measurement of Sublimation From Thermionic Emitters (Withdrawn 1984)
- ASTM-F533 - Standard Test Method for Thickness and Thickness Variation of Silicon Wafers (Withdrawn 2003)
- ASTM-F534 - Standard Test Method for Bow of Silicon Wafers (Withdrawn 2003)
- ASTM-F570 - Test Method for Transistor Collector-Emitter Saturation Voltage (Withdrawn 1995)
- ASTM-F576 - Standard Test Method for Measurement of Insulator Thickness and Refractive Index on Silicon Substrates by Ellipsometry (Withdrawn 2003)
- ASTM-F580 - Test Method for Adhesion Strength of Bondable Films to Substrates in Ribbon-Wire Bonds (Withdrawn 1996)
- ASTM-F584 - Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire (Withdrawn 2015)
- ASTM-F613 - Test Method for Measuring Diameter of Semiconductor Wafers (Withdrawn 2001)
- ASTM-F615M - Standard Practice for Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components (Metric) (Withdrawn 2022)
- ASTM-F616M - Standard Test Method for Measuring MOSFET Drain Leakage Current (Metric) (Withdrawn 2009)
- ASTM-F617 - Standard Test Method for Measuring MOSFET Linear Threshold Voltage (Withdrawn 2006)
- ASTM-F618 - Method for Measuring MOSFET Saturated Threshold Voltage
- ASTM-F632 - Test Method for Measuring Small-Signal Comon Emitter Current Gain of Transistors at High Frequencies (Withdrawn 1995)
- ASTM-F635 - Guide for Selection of Tests for Material Properties of Liquid Thermoset Encapsulating Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 1996)
- ASTM-F636 - Guide for Selection of Tests for Material Properties of Transfer Molding Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 1996)
- ASTM-F637 - Standard Specification for Format, Physical Properties, and Test Methods for 19 and 35 mm Testable Tape Carrier for Perimeter Tape Carrier-Bonded Semiconductor Devices
- ASTM-F638 - Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding
- ASTM-F65 - Specification for Primary Amyl Acetate (Mixed Isomers) for Use in Fabricating Electron Devices (Withdrawn 1989)
- ASTM-F652 - Method for Measuring Mica Stampings or Substitutes Used in Electron Devices and Lamps
- ASTM-F657 - Standard Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning (Withdrawn 2003)
- ASTM-F671 - Standard Test Method for Measuring Flat Length on Wafers of Silicon and Other Electronic Materials (Withdrawn 2003)
- ASTM-F672 - Standard Test Method for Measuring Resistivity Profiles Perpendicular to the Surface of a Silicon Wafer Using a Spreading Resistance Probe (Withdrawn 2003)
- ASTM-F673 - Standard Test Methods for Measuring Resistivity of Semiconductor Slices or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gage (Withdrawn 2003)
- ASTM-F674 - Standard Practice for Preparing Silicon for Spreading Resistance Measurements (Withdrawn 2003)
- ASTM-F675 - Test Method for Measuring Nonequilibrium Transient Photocurrents in P-N Junctions (Withdrawn 1995)
- ASTM-F676 - Standard Test Method for Measuring Unsaturated TTL Sink Current (Withdrawn 2009)
- ASTM-F69 - Specification for Diethyl Oxalate for Use in Fabricating Electron Devices (Withdrawn 1984)
- ASTM-F692 - Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates (Withdrawn 2008)
- ASTM-F7 - Standard Specification for Aluminum Oxide Powder
- ASTM-F70 - Specification for Cathode Carbonates (Withdrawn 1989)
- ASTM-F72 - Standard Specification for Gold Wire for Semiconductor Lead Bonding
- ASTM-F723 - Standard Practice for Conversion Between Resistivity and Dopant Density for Boron-Doped, Phosphorus-Doped, and Arsenic-Doped Silicon (Withdrawn 2003)
- ASTM-F728 - Standard Practice for Preparing An Optical Microscope for Dimensional Measurements (Withdrawn 2003)
- ASTM-F73 - Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps
- ASTM-F744M - Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits (Metric) (Withdrawn 2023)
- ASTM-F76 - Standard Test Methods for Measuring Resistivity and Hall Coefficient and Determining Hall Mobility in Single-Crystal Semiconductors (Withdrawn 2023)
- ASTM-F769 - Standard Test Method for Measuring Transistor and Diode Leakage Currents (Withdrawn 2006)
- ASTM-F773M - Standard Practice for Measuring Dose Rate Response of Linear Integrated Circuits (Metric) (Withdrawn 2023)
- ASTM-F774 - Guide for Analysis of Latchup Susceptibility in Bipolar Integrated Circuits (Withdrawn 1987)
- ASTM-F775 - Test Method for Wafer and Slice Flatness by Interferometric (Withdrawn 1991)
- ASTM-F78 - Standard Test Method for Calibration of Helium Leak Detectors by Use of Secondary Standards (Withdrawn 2008)
- ASTM-F798 - Standard Practice for Determining Gettering Rate, Sorption Capacity, and Gas Content of Nonevaporable Getters in the Molecular Flow Region (Withdrawn 2008)
- ASTM-F81 - Standard Test Method for Measuring Radial Resistivity Variation on Silicon Wafers (Withdrawn 2003)
- ASTM-F816 - Standard Test Method for Combined Fine and Gross Leaks for Large Hybrid Microcircuit Packages (Withdrawn 2009)
- ASTM-F817 - Test Method for Characterization of Film Resistor Materials and Processes (Withdrawn 1996)
- ASTM-F83 - Standard Practice for Definition and Determination of Thermionic Constants of Electron Emitters (Withdrawn 2023)
- ASTM-F84 - Standard Test Method for Measuring Resistivity of Silicon Wafers With an In-Line Four-Point Probe (Withdrawn 2003)
- ASTM-F847 - Standard Test Methods for Measuring Crystallographic Orientation of Flats on Single Crystal Silicon Wafers by X-Ray Techniques (Withdrawn 2003)
- ASTM-F85 - Standard Practice for Nomenclature for Wire Leads Used as Conductors in Electron Tubes (Withdrawn 2023)
- ASTM-F867M - Guide for Ionizing Radiation Effects (Total Dose) Testing of Semiconductor Devices [Metric] (Withdrawn 1998)
- ASTM-F928 - Standard Test Methods for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates (Withdrawn 2003)
- ASTM-F95 - Standard Test Method for Thickness of Lightly Doped Silicon Epitaxial Layers on Heavily Doped Silicon Substrates Using an Infrared Dispersive Spectrophotometer (Withdrawn 2003)
- ASTM-F950 - Standard Test Method for Measuring the Depth of Crystal Damage of a Mechanically Worked Silicon Slice Surface by Angle Polishing and Defect Etching (Withdrawn 2003)
- ASTM-F951 - Standard Test Method for Determination of Radial Interstitial Oxygen Variation in Silicon Wafers (Withdrawn 2003)
- ASTM-F96 - Standard Specification for Electronic Grade Alloys of Copper and Nickel in Wrought Forms
- ASTM-F97 - Standard Practices for Determining Hermeticity of Electron Devices by Dye Penetration
- ASTM-F978 - Standard Test Method for Characterizing Semiconductor Deep Levels by Transient Capacitance Techniques (Withdrawn 2003)
- ASTM-F979 - Standard Test Method for Hermeticity of Hybrid Microcircuit Packages Prior to Lidding (Withdrawn 2009)
- ASTM-F980 - Standard Guide for Measurement of Rapid Annealing of Neutron-Induced Displacement Damage in Silicon Semiconductor Devices
- ASTM-F980M - Standard Guide for Measurement of Rapid Annealing of Neutron-Induced Displacement Damage in Silicon Semiconductor Devices [Metric]
- ASTM-F996 - Standard Test Method for Separating an Ionizing Radiation-Induced MOSFET Threshold Voltage Shift Into Components Due to Oxide Trapped Holes and Interface States Using the Subthreshold Current–Voltage Characteristics (Withdrawn 2023)