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Document Center List of Standards on Semiconductor Devices In General

ICS Code 31.080.01

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Up to Level 2:

• 31.080 (Semiconductor devices Semiconducting materials, see 29.045)

The following documents are a part of this series:

ASTM:

• ASTM-E1161 - Standard Practice for Radiographic Examination of Semiconductors and Electronic Components
• ASTM-E427 - Standard Practice for Testing for Leaks Using the Halogen Leak Detector(Alkali-Ion Diode) (Withdrawn 2013)
• ASTM-E431 - Standard Guide to Interpretation of Radiographs of Semiconductors and Related Devices
• ASTM-E722 - Standard Practice for Characterizing Neutron Fluence Spectra in Terms of an Equivalent Monoenergetic Neutron Fluence for Radiation-Hardness Testing of Electronics
• ASTM-F1032 - Guide for Measuring Time-Dependant Total-Dose Effects in Semiconductor Devices Exposed to Pulsed Ionizing Radiation (Withdrawn 1994)
• ASTM-F1190 - Standard Guide for Neutron Irradiation of Unbiased Electronic Components
• ASTM-F1191 - Guide for the Radiation Testing of Semiconductor Memories (Withdrawn 1993)
• ASTM-F1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices
• ASTM-F1211 - Standard Specification for Semiconductor Device Passivation Opening Layouts
• ASTM-F1892 - Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices
• ASTM-F1893 - Guide for Measurement of Ionizing Dose-Rate Survivability and Burnout of Semiconductor Devices (Withdrawn 2023)
• ASTM-F615 - Practice for Determining Safe Current Pulse Operating Regions for Metallization on Semiconductor Components (Withdrawn 1995) Use ASTM-F615M
• ASTM-F618 - Method for Measuring MOSFET Saturated Threshold Voltage
• ASTM-F775 - Test Method for Wafer and Slice Flatness by Interferometric (Withdrawn 1991)
• ASTM-F78 - Standard Test Method for Calibration of Helium Leak Detectors by Use of Secondary Standards (Withdrawn 2008)
• ASTM-F867M - Guide for Ionizing Radiation Effects (Total Dose) Testing of Semiconductor Devices [Metric] (Withdrawn 1998)

BSI:

• BS-3934 - Specification for dimensions of semiconductor devices and integrated electronic circuits
• BS-3934-4 - Recommendations for a Coding System and Classification Intoforms of Package Outlines
• BS-3934-5 - Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits
• BS-6493-1.1 - Part 1.1: Discrete Devices - General, Semiconductor Devices
• BS-7241 - Specification for IEC 822 VSB: parallel sub-system bus of the IEC 821 VME bus
• BS-7302 - Specification for microprocessor universal format object modules
• BS-EN-60191-3 - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of integrated circuits
• BS-EN-60191-4 - Mechanical standardization of semiconductor devices
• BS-EN-60191-6 - Mechanical standardization of semiconductor devices
• BS-EN-60191-6-1 - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages
• BS-EN-60191-6-12 - Mechanical standardization of semiconductor devices
• BS-EN-60191-6-13 - Mechanical standardization of semiconductor devices
• BS-EN-60191-6-16 - Mechanical standardization of semiconductor devices
• BS-EN-60191-6-18 - Mechanical standardization of semiconductor devices
• BS-EN-60191-6-22 - Mechanical standardization of semiconductor devices
• BS-EN-60191-6-3 - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP)
• BS-EN-60191-6-5 - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages
• BS-EN-60191-6-6 - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages
• BS-EN-60191-6-8 - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages
• BS-EN-60747-5-5 - Semiconductor devices. Discrete devices
• BS-EN-60749 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-10 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-11 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-12 - Semiconductor devices. Mechanical and climatic test methods. Vibration, variable frequency
• BS-EN-60749-13 - Semiconductor devices. Mechanical and climatic test methods. Salt atmosphere
• BS-EN-60749-15 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-19 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-2 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-20 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-20-1 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-21 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-23 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-24 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-26 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-27 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-28 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-29 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-3 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-30 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-32 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-35 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-37 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-38 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-39 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-4 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-40 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-42 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-43 - Semiconductor devices - Mechanical and climatic test methods
• BS-EN-60749-44 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-5 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-5-TC - Tracked Changes. Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-6 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-7 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-60749-9 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-61975 - High-voltage direct current (HVDC) installations. System tests
• BS-EN-62007-1 - Semiconductor optoelectronic devices for fibre optic system applications
• BS-EN-62007-2 - Semiconductor optoelectronic devices for fibre optic system applications
• BS-EN-62374 - Semiconductor devices. Time dependent dielectric breakdown (TDDB) test for gate dielectric films
• BS-EN-62374-1 - Semiconductor devices
• BS-EN-62415 - Semiconductor devices. Constant current electromigration test
• BS-EN-62418 - Semiconductor devices. Metallization stress void test
• BS-EN-62779-1 - Semiconductor devices. Semiconductor interface for human body communication
• BS-EN-62779-2 - Semiconductor devices. Semiconductor interface for human body communication
• BS-EN-62779-3 - Semiconductor devices. Semiconductor interface for human body communication
• BS-EN-IEC-60068-2-13 - Environmental testing
• BS-EN-IEC-60191-1 - Mechanical standardization of semiconductor devices
• BS-EN-IEC-60747-16-6 - Semiconductor devices
• BS-EN-IEC-60747-5-5 - Semiconductor devices
• BS-EN-IEC-60749-10 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-IEC-60749-10-TC - Tracked Changes. Semiconductor devices. Mechanical and climatic test methods
• BS-EN-IEC-60749-12 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-IEC-60749-13 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-IEC-60749-15 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-IEC-60749-17 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-IEC-60749-20 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-IEC-60749-26 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-IEC-60749-26-TC - Tracked Changes. Semiconductor devices. Mechanical and climatic test methods
• BS-EN-IEC-60749-28 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-IEC-60749-28-TC - Tracked Changes. Semiconductor devices. Mechanical and climatic test methods
• BS-EN-IEC-60749-30 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-IEC-60749-37 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-IEC-60749-39 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-IEC-60749-39-TC - Tracked Changes. Semiconductor devices. Mechanical and climatic test methods
• BS-EN-IEC-60749-41 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-IEC-60749-5 - Semiconductor devices. Mechanical and climatic test methods
• BS-EN-IEC-60749-5-TC - Tracked Changes. Semiconductor devices. Mechanical and climatic test methods
• BS-EN-IEC-62435-9 - Electronic components. Long-term storage of electronic semiconductor devices
• BS-EN-IEC-63244-1 - Semiconductor devices. Semiconductor devices for wireless power transfer and charging
• BS-EN-IEC-63287-1 - Semiconductor devices. Generic semiconductor qualification guidelines
• BS-EN-IEC-63287-2 - Semiconductor devices. Guidelines for reliability qualification plans
• BS-EN-IEC-63364-1 - Semiconductor devices. Semiconductor devices for IoT system
• BS-IEC-60068-2-77 - Environmental testing. Test methods. Body strength and impact shock
• BS-IEC-60191-1 - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of discrete devices
• BS-IEC-60191-2 - Mechanical standardization of semiconductor devices
• BS-IEC-60191-6-13 - Mechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
• BS-IEC-60747-1 - Semiconductor devices
• BS-IEC-60747-10 - Semiconductor devices
• BS-IEC-60747-14-1 - Semiconductor devices
• BS-IEC-60747-14-10 - Semiconductor devices
• BS-IEC-60747-14-11 - Semiconductor devices
• BS-IEC-60747-14-2 - Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors
• BS-IEC-60747-14-4 - Semiconductor devices. Discrete devices
• BS-IEC-60747-14-5 - Semiconductor devices
• BS-IEC-60747-16-2 - Semiconductor devices
• BS-IEC-60747-18-3 - Semiconductor devices
• BS-IEC-60747-19-1 - Semiconductor devices
• BS-IEC-60747-5-15 - Semiconductor devices
• BS-IEC-60747-5-4 - Semiconductor devices
• BS-IEC-60747-5-9 - Semiconductor devices
• BS-IEC-62047-29 - Semiconductor devices. Micro-electromechanical devices
• BS-IEC-62483 - Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
• BS-IEC-62615 - Electrostatic discharge sensitivity testing. Transmission line pulse (TLP). Component level
• BS-IEC-62779-4 - Semiconductor devices. Semiconductor interface for human body communication
• BS-IEC-62830-5 - Semiconductor devices. Semiconductor devices for energy harvesting and generation
• BS-IEC-62830-6 - Semiconductor devices. Semiconductor devices for energy harvesting and generation
• BS-IEC-62880-1 - Semiconductor devices. Stress migration test standard
• BS-IEC-62951-5 - Semiconductor devices. Flexible and stretchable semiconductor devices
• BS-IEC-62951-8 - Semiconductor devices. Flexible and stretchable semiconductor devices
• BS-IEC-63068-3 - Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices
• BS-IEC-63229 - Semiconductor devices. Classification of defects in gallium nitride epitaxial film on silicon carbide substrate
• BS-IEC-63284 - Semiconductor devices. Reliability test method by inductive load switching for gallium nitride transistors
• BS-QC-750100 - Harmonized system of quality assessment for electronic components. Discrete semiconductor devices. Sectional specification
• DD-IEC/PAS-62050 - Board level drop test method of components for handheld electronicproduc ts
• DD-IEC/PAS-62483 - Test method for measuring whisker growth on tin and tin alloy surface finishes
• PD-ES-59008-1 - Data Requirements for Semiconductor Die, General Requirements
• PD-ES-59008-2 - Data requirements for semiconductor die
• PD-ES-59008-3 - Data requirements for semiconductor die
• PD-ES-59008-4-1 - Data requirements for semiconductor die. Specific requirements and recommendations
• PD-ES-59008-4-3 - Data Requirements for Semiconductor Die, Specific Requirements & Recommendations, Ther
• PD-ES-59008-4-4 - Data requirements for semiconductor die. Specific requirements and recommendations
• PD-ES-59008-5-1 - Data requirements for semiconductor die. Particular requirements and recommendations for die types
• PD-ES-59008-5-2 - Data requirements for semiconductor die. Particular requirements and recommendations for die types. Bare die with added connection structures
• PD-ES-59008-6-1 - Part 6: Section 1: Exchange Data Formats and Data Dictionary- Data Exchange - Ddx File
• PD-ES-59008-6-2 - Data requirements for semiconductor die. Exchange data formats and data dictionary
• PD-IEC-62380 - Reliability data handbook. Universal model for reliability prediction of electronics components, PCBs and equipment
• PD-IEC-63133 - Semiconductor devices. Scan based ageing level estimation for semiconductor devices
• PD-IEC-63378-1 - Thermal standardization on semiconductor packages
• PD-IEC/PAS-62240 - Use of semiconductor devices outside manufacturer's specified temperature ranges

IEC:

• IEC-191-2 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
• IEC-191-2T - Eighteenth supplement
• IEC-60050-521-AM1 - Amendment 1 - International Electrotechnical Vocabulary - Part 521: Semiconductor devices and integrated circuits
• IEC-60050-521-AM2 - Amendment 2 . International Electrotechnical Vocabulary (IEV) . Part 521: Semiconductor devices and integrated circuits
• IEC-60191-1 - Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
• IEC-60191-10 - Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2-10 - Amendment 10 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2-11 - Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2-12 - Amendment 12 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2-13 - Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2-14 - Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2-15 - Amendment 15 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2-16 - Amendment 16 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2-17 - Amendment 17 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2-18 - Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2-19 - Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2-2 - Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2-3 - Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2-4 - Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2-5 - Amendment 5
• IEC-60191-2-6 - Amendment 6
• IEC-60191-2-7 - Amendment 7
• IEC-60191-2-8 - Amendment 8 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2-9 - Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2-AM20 - Amendment 20 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2-AM21 - Amendment 21 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2U - Nineteenth supplement
• IEC-60191-2V - Twentieth supplement
• IEC-60191-2W - Twenty-first supplement
• IEC-60191-2X - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2Y - Twenty-third supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-2Z - Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions
• IEC-60191-3 - Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
• IEC-60191-4 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• IEC-60191-4-AM1 - Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
• IEC-60191-6 - Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
• IEC-60191-6-1 - Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
• IEC-60191-6-10 - Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
• IEC-60191-6-12 - Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
• IEC-60191-6-13 - Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
• IEC-60191-6-16 - Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
• IEC-60191-6-17 - Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
• IEC-60191-6-18 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
• IEC-60191-6-19 - Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
• IEC-60191-6-2 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
• IEC-60191-6-20 - Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
• IEC-60191-6-21 - Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
• IEC-60191-6-22 - Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
• IEC-60191-6-3 - Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
• IEC-60191-6-4 - Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
• IEC-60191-6-5 - Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
• IEC-60191-6-6 - Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
• IEC-60191-6-8 - Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
• IEC-60747-12-4 - Part 12-4: Optoelectronic Devices - Blank Detail Specification for Pin-Fet Modules With/Wi
• IEC-60747-12-6 - Part 12-6: Optoelectronic Devices - Blank Detail Specification for Avalanche Photodiodes
• IEC-60747-14-1 - Semiconductor devices - Part 14-1: Semiconductor sensors - Generic specification for sensors
• IEC-60747-14-10 - Semiconductor devices - Part 14-10: Semiconductor sensors - Performance evaluation methods for wearable glucose sensors
• IEC-60747-14-11 - Semiconductor devices - Part 14-11: Semiconductor sensors - Test method of surface acoustic wave-based integrated sensors for measuring ultraviolet, illumination and temperature
• IEC-60747-14-4 - Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
• IEC-60747-14-5 - Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
• IEC-60747-16-2 - Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers
• IEC-60747-16-2-1 - Amendment 1 - Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers
• IEC-60747-18-2 - Semiconductor devices - Part 18-2: Semiconductor bio sensors - Evaluation process of lens-free CMOS photonic array sensor package modules
• IEC-60747-5-1 - Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General
• IEC-60747-5-1-1 - Amendment 1
• IEC-60747-5-4 - Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
• IEC-60747-5-5 - Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers
• IEC-60747-5-5-AM1 - Amendment 1 - Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers
• IEC-60747-9 - Semiconductor devices - Part 9: Discrete devices - Insulated-gate bipolar transistors (IGBTs)
• IEC-60749-1 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General
• IEC-60749-10 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
• IEC-60749-11 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
• IEC-60749-12 - Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
• IEC-60749-13 - Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
• IEC-60749-14 - Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
• IEC-60749-15 - Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
• IEC-60749-15-RL - Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
• IEC-60749-16 - Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
• IEC-60749-17 - Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
• IEC-60749-18 - Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
• IEC-60749-18-RL - Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
• IEC-60749-19 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
• IEC-60749-19-AM1 - Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
• IEC-60749-2 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
• IEC-60749-20 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
• IEC-60749-20-1 - Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
• IEC-60749-20-1-RL - Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
• IEC-60749-20-RL - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
• IEC-60749-21 - Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
• IEC-60749-22 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
• IEC-60749-23 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
• IEC-60749-23-AM1 - Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
• IEC-60749-25 - Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
• IEC-60749-26 - Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
• IEC-60749-27 - Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
• IEC-60749-27-AM1 - Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
• IEC-60749-28 - Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
• IEC-60749-28-RL - Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
• IEC-60749-29 - Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
• IEC-60749-3 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
• IEC-60749-30 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
• IEC-60749-30-AM1 - Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
• IEC-60749-30-RL - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
• IEC-60749-31 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
• IEC-60749-32 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
• IEC-60749-32-AM1 - Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
• IEC-60749-34 - Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
• IEC-60749-35 - Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
• IEC-60749-36 - Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
• IEC-60749-37 - Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
• IEC-60749-38 - Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
• IEC-60749-39 - Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
• IEC-60749-39-RL - Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
• IEC-60749-4 - Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
• IEC-60749-40 - Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
• IEC-60749-41 - Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices
• IEC-60749-42 - Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
• IEC-60749-43 - Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
• IEC-60749-44 - Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
• IEC-60749-5 - Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
• IEC-60749-6 - Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
• IEC-60749-7 - Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
• IEC-60749-8 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
• IEC-60749-9 - Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
• IEC-61975 - High-voltage direct current (HVDC) installations - System tests
• IEC-61975-AM1 - Amendment 1 - High-voltage direct current (HVDC) installations - System tests
• IEC-61975-AM2 - Amendment 2 - High-voltage direct current (HVDC) installations - System tests
• IEC-62007-1 - Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics
• IEC-62007-1-AM1 - Amendment 1 - Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics
• IEC-62007-2 - Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods
• IEC-62483 - Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
• IEC-62779-1 - Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
• IEC-62779-2 - Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
• IEC-62779-3 - Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
• IEC-62779-4 - Semiconductor devices - Semiconductor interface for human body communication - Part 4: Capsule endoscope
• IEC-62880-1 - Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard
• IEC-63133 - Semiconductor devices - Scan based ageing level estimation for semiconductor devices
• IEC-63287-1 - Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification
• IEC-63287-2 - Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile
• IEC-63378-1 - Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
• IEC-747-10 - Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
• IEC-747-10-3 - Amendment No. 3 to IEC 747-10
• IEC-747-11 - Semiconductor devices. Discrete devices. Part 11: Sectional specification for discrete devices
• IEC-747-11-1 - Amendment No. 1
• IEC-747-11-2 - Amendment No. 2 to IEC 747-11
• IEC/PAS-60191-6-18 - Part 6-18: General Rules for the Preparation of Outline Drawings of Surface Mounted Se
• IEC/PAS-60191-6-19 - Part 6-19: Measurement Methods of Package Warpage at Elevated Temperature & the Maximu
• IEC/PAS-61300-3-29 - Part 3-29: Examinations & Measurements - Measurement Techniques for Characterizing the Amp
• IEC/PAS-61975 - System Tests for High-Voltage Direct Current (Hvdc) Installations
• IEC/PAS-62050 - Board Level Drop Test Method of Components for Handheld Electronic Products
• IEC/PAS-62162 - Field-induced charged-device model test method for electrostatic discharge withstand thresholds of microelectronic components
• IEC/PAS-62168 - Symbols & Labels for Moisture-Sensitive Devices
• IEC/PAS-62169 - Standard for Handling, Packing, Shipping & Use of Moisture/Reflow Sensitive Surface Mo
• IEC/PAS-62178 - Temperature Cycling
• IEC/PAS-62179 - Electrostatic Discharge (Esd) Sensitivity Testing Human Bodymodel (Hbm)
• IEC/PAS-62180 - Electrostatic Discharge (Esd) Sensitivity Testing Machine Model (mm)
• IEC/PAS-62182 - Preconditioning of Nonhermetic Surface Mount Devices Prior To Reliability Testing
• IEC/PAS-62189 - Bias Life
• IEC/PAS-62201 - Procedure for Executing Sweat
• IEC/PAS-62202 - Failure Mechanisms & Models for Silicon Semiconductor Devices
• IEC/PAS-62203 - Guide for the Standard Probe Pad Sizes & Layouts for Wafer-Level Electrical Testing
• IEC/PAS-62204 - Standard Method for Measuring & Using the Temperature Coefficient of Resistance To Determi
• IEC/PAS-62206 - Power & Temperature Cycling
• IEC/PAS-62483 - Test Method for Measuring Whisker Growth on Tin & Tin Alloy Surface Finishes

Other SDOs:

• EN-60191-6 - Part 6: General Rules for the Preparation of Outline Drawings of Surfce Mounted Semico
• EN-60191-6-1 - Mechanical Standardization of Semiconductor Devices, General Rules for the Preparation
• EN-60191-6-12 - Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
• EN-60191-6-13 - Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
• EN-60191-6-16 - Mechanical Standardization of Semiconductor Devices, Glossary of Semiconductor Tests &
• EN-60191-6-17 - Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
• EN-60191-6-18 - Part 6-18: General Rules for the Preparation of Outline Drawings of Surface Mounted, M
• EN-60191-6-22 - Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
• EN-60191-6-3 - Mechanical Standardization of Semiconductor Devices, General Rules for the Preparation
• EN-60747-5-5 - Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers
• EN-60749-15 - Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
• EN-60749-20 - Part 20: Resistance of Plastic Encapsulated Smds To the Combined Effect of Moisture &
• EN-60749-20-1 - Part 20-1: Handling, Packing, Labelling & Shipping of Surface-Mount Devices Sensitive
• EN-60749-21 - Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
• EN-60749-23 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
• EN-60749-24 - Semiconductor Devices, Mechanical & Climatic Test Methods, Accelerated Moisture Resist
• EN-60749-26 - Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
• EN-60749-27 - Semiconductor Devices, Mechanical & Climatic Test Methods, Electrostatic Discharge (Es
• EN-60749-28 - Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
• EN-60749-29 - Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
• EN-60749-3 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
• EN-60749-30 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
• EN-60749-34 - Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
• EN-60749-37 - Semiconductor Devices, Mechanical & Climatic Test Methods, Board Level Drop Test Metho
• EN-60749-38 - Semiconductor Devices, Mechanica & Climatic Test Methods, Soft Error Test Method for S
• EN-60749-39 - Semiconductor Devices, Mechanical & Climatic Test Methods, Measurement of Moisture Dif
• EN-60749-4 - Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
• EN-60749-40 - Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
• EN-60749-42 - Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
• EN-60749-44 - Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
• EN-60749-5 - Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
• EN-60749-6 - Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
• EN-60749-7 - Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
• EN-60749-9 - Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
• EN-61975 - High-voltage direct current (HVDC) installations - System tests
• EN-62007-1 - Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics
• EN-62007-2 - Semiconductor Optoelectronic Devices for Fibre Optic System Applications, Measuring M
• EN-62374 - Semiconductor devices - Time Dependent Dielectric Breakdown (TDDB) test for gate dielectric films
• EN-62374-1 - Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
• EN-62415 - Semiconductor Devices - Constant Current Electromigration Test
• EN-62418 - Semiconductor Devices - Metallization Stress Void Test
• EN-62779-1 - Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
• EN-62779-2 - Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
• EN-62779-3 - Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
• EN-IEC-60191-1 - Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
• EN-IEC-60749-12 - Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
• EN-IEC-60749-13 - Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
• EN-IEC-60749-17 - Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (IEC 60749-17:2019)
• EN-IEC-60749-18 - Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (IEC 60749-18:2019)
• EN-IEC-60749-26 - Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)