Document Center List of Standards on Electronic Component Assemblies Including Preassembled Modules
ICS Code 31.190
Return to ICS Index.Up to Level 1:
The following documents are a part of this series:
BSI:
- BS-9800 - Specification for capability approval of modular electronic networks: generic specification
- BS-EN-160000 - Harmonized system of quality assessment for electronic components. Generic specification: modular electronic units
- BS-EN-160200-1 - Harmonized system of quality assessment for electronic components. Sectional specification. Microwave modular electronic units of assessed quality. Capability approval procedure
- BS-EN-160201 - Harmonized system of quality assessment for electronic components. Blank detail specification. Microwave modular electronic units of assessed quality. Capability approval
- BS-EN-60068-2-21 - Environmental testing
- BS-EN-60068-2-58 - Environmental testing
- BS-EN-60068-2-69 - Environmental testing
- BS-EN-60068-2-82 - Environmental testing
- BS-EN-60068-2-83 - Environmental testing
- BS-EN-60194 - Printed board design, manufacture and assembly. Terms and definitions
- BS-EN-61189-6 - Test methods for electrical materials, interconnection structures and assemblies
- BS-EN-61190-1-1 - Attachment materials for electronic assembly
- BS-EN-61190-1-2 - Attachment materials for electronic assembly
- BS-EN-61190-1-3 - Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
- BS-EN-61191-2 - Printed board assemblies
- BS-EN-61192-5 - Workmanship requirements for soldered electric assemblies
- BS-EN-61193-2 - Quality assessment systems
- BS-EN-61193-3 - Quality assessment systems
- BS-EN-61760-3 - Surface mounting technology
- BS-EN-61760-4 - Surface mounting technology
- BS-EN-62090 - Product package labels for electronic components using bar code and two- dimensional symbologies
- BS-EN-62137 - Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
- BS-EN-62137-1-1 - Surface mounting technology. Environmental and endurance test methods for surface mount solder joint
- BS-EN-62137-1-2 - Surface mounting technology. Environmental and endurance test methods for surface mount solder joint
- BS-EN-62137-1-3 - Surface mounting technology. Environmental and endurance test methods for surface mount solder joint
- BS-EN-62137-1-4 - Surface mounting technology. Environmental and endurance test methods for surface mount solder joint
- BS-EN-62137-1-5 - Surface mounting technology. Environmental and endurance test methods for surface mount solder joints
- BS-EN-62137-3 - Electronics assembly technology
- BS-EN-62137-4 - Electronics assembly technology
- BS-EN-62421 - Electronics assembly technology. Electronic modules
- BS-EN-62739-1 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy
- BS-EN-62739-2 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy
- BS-EN-62739-3 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy
- BS-EN-62878-1-1 - Device embedded substrate
- BS-EN-IEC-60068-2-82 - Environmental testing
- BS-EN-IEC-61188-6-1 - Circuit boards and circuit board assemblies. Design and use
- BS-EN-IEC-61188-6-2 - Circuit boards and circuit board assemblies. Design and use
- BS-EN-IEC-61188-6-4 - Printed boards and printed board assemblies. Design and use
- BS-EN-IEC-61190-1-3 - Attachment materials for electronic assembly
- BS-EN-IEC-61190-1-3-TC - Tracked Changes. Attachment materials for electronic assembly
- BS-EN-IEC-61191-1 - Printed board assemblies
- BS-EN-IEC-61191-1-TC - Tracked Changes. Printed board assemblies
- BS-EN-IEC-61760-3 - Surface mounting technology
- BS-EN-IEC-62435-9 - Electronic components. Long-term storage of electronic semiconductor devices
- BS-EN-IEC-62878-1 - Device embedding assembly technology
- BS-EN-IEC-62878-2-602 - Device embedding assembly technology
- BS-EN-IEC-63215-2 - Endurance test methods for die attach materials
- BS-IEC-60068-2-69 - Environmental testing. Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
- DD-IEC/PAS-62137-3 - Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints
- DD-IEC/PAS-62588 - Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
- PD-IEC-61188-8 - Circuit boards and circuit board assemblies. Design and use
- PD-IEC-61191-7 - Printed board assemblies
- PD-IEC-61760-3-1 - Surface mounting technology
- PD-IEC-61760-5-1 - Surface mounting technology
- PD-IEC-62878-2-1 - Device embedded substrate
- PD-IEC-62878-2-10 - Device embedding assembly technology
- PD-IEC-62878-2-2 - Device embedded substrate
- PD-IEC-62878-2-3 - Device embedded substrate
- PD-IEC-62878-2-4 - Device embedded substrate
- PD-IEC-62878-2-9 - Device embedding assembly technology
- PD-IEC-PAS-61191-10 - Printed board assemblies
- PD-IEC/PAS-62878-2-5 - Device embedded substrate. Guidelines. Data format
- PD-IEC-TR-62878-2-8 - Device embedding assembly technology
IEC:
- IEC-60068-2-21 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
- IEC-60068-2-58 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC-60068-2-58-AM1 - Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC-60068-2-69 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
- IEC-60068-2-69-AM1 - Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
- IEC-60068-2-77 - Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
- IEC-60068-2-82 - Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies
- IEC-60068-2-83 - Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
- IEC-60194 - Printed board design, manufacture and assembly - Terms and definitions
- IEC-60939-2-1 - Complete filter units for radio interference suppression - Part 2-1: Blank detail specification - Passive filter units for electromagnetic interference suppression - Filters for which safety tests are required (assessment level D/DZ)
- IEC-60939-2-2 - Complete filter units for radio interference suppression - Part 2-2: Blank detail specification - Passive filter uits for electromagnetic interference suppression - Filters for which safety tests are required (safety tests only)
- IEC-61188-5-1 - Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
- IEC-61188-5-2 - Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
- IEC-61188-5-6 - Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
- IEC-61188-6-1 - Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards
- IEC-61188-8 - Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library
- IEC-61190-1-1 - Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
- IEC-61190-1-2 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
- IEC-61190-1-3 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
- IEC-61190-1-3-AM1 - Amendment 1: Attachment Materials for Electronic Assembly - Part 1-3: Requirements Fo
- IEC-61191-1 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
- IEC-61191-1-RL - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
- IEC-61191-2 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
- IEC-61191-7 - Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
- IEC-61191-8 - Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
- IEC-61191-9 - Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices
- IEC-61192-1 - Workmanship requirements for soldered electronic assemblies - Part 1: General
- IEC-61192-2 - Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
- IEC-61192-3 - Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
- IEC-61192-4 - Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
- IEC-61192-5 - Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
- IEC-61193-1 - Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
- IEC-61193-2 - Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
- IEC-61193-3 - Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
- IEC-61760-3 - Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
- IEC-61760-3-1 - Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering . Guidelines for through hole diameter design with solder paste surface printing method
- IEC-61760-4 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- IEC-61760-4-AM1 - Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- IEC-61760-5-1 - Surface mounting technology - Part 5-1: Surface strain on circuit boards - Strain gauge measurement applied to chip components
- IEC-62090 - Product package labels for electronic components using bar code and two-dimensional symbologies
- IEC-62137 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
- IEC-62137-1-1 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
- IEC-62137-1-2 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
- IEC-62137-1-3 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
- IEC-62137-1-4 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
- IEC-62137-1-5 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
- IEC-62137-3 - Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
- IEC-62137-4 - Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- IEC-62421 - Electronics Assembly Technology - Electronic Modules
- IEC-62739-1 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
- IEC-62739-2 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
- IEC-62739-3 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
- IEC-62878-1 - Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
- IEC-62878-1-1 - Device embedded substrate - Part 1-1: Generic specification - Test methods
- IEC-62878-2-1 - Device embedded substrate - Part 2-1: Guidelines - General description of technology
- IEC-62878-2-2 - Device embedded substrate - Part 2-2: Guidelines - Electrical testing
- IEC-62878-2-3 - Device embedded substrate - Part 2-3: Guidelines - Design guide
- IEC-62878-2-4 - Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
- IEC-62878-2-5 - Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
- IEC-62878-2-602 - Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
- IEC-62878-2-8 - Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
- IEC-62878-2-9 - Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
- IEC/PAS-61191-10 - Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies
- IEC/PAS-62137-3 - Electronics Assembly Technology - Selection Guidance of Environmental & Endurance Test
- IEC/PAS-62588 - Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
- IEC/PAS-62878-2-5 - Device embedded substrate - Guidelines - Data format
Other SDOs:
- EN-160200-1 - Harmonized System of Quality Assessment for Electronic Components, Sectional Specifica
- EN-60068-2-21 - Part 2-21: Tests - Test U: Robustness of Terminations & Integral Mounting Devices, Env
- EN-60068-2-58 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- EN-60068-2-69 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
- EN-60068-2-82 - Environmental Testing, Tests, Test Tx, Whisker Test Methods for Electronic & Electric
- EN-60068-2-83 - Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
- EN-60194 - Printed Board Design, Manufacture & Assembly - Terms & Definitions
- EN-61189-6 - Test Methods for Electrical Materials, Interconnection Structures & Assemblies, Test M
- EN-61190-1-2 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
- EN-61190-1-3 - Part 1-3: Requirements for Electronic Grade Solder Alloys & Fluxed & Non-Fluxed Solid
- EN-61191-1 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
- EN-61191-2 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
- EN-61192-5 - Workmanship Requirements for Soldered Electric Assemblies, Rework, Modification & Repa
- EN-61193-2 - Quality Assessment Systems, Selection & Use of Sampling Plans for Inspection of Electr
- EN-61193-3 - Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
- EN-61760-3 - Part 3: Standard Method for the Specification of Components for Through Hole Reflow (
- EN-61760-4 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
- EN-62090 - Product package labels for electronic components using bar code and two- dimensional symbologies
- EN-62137-1-1 - Surface Mounting Technology, Environmental & Endurance Test Methods for Surface Mount
- EN-62137-1-2 - Surface Mounting Technology, Environmental & Endurance Test Methods for Surface Mount
- EN-62137-1-4 - Part 1-4: Cyclic Bending Test, Surface Mounting Technology - Environmental & Endurance
- EN-62137-1-5 - Part 1-5: Mechanical Shear Fatigue Test, Surface Mounting Technology - Environmental &
- EN-62137-3 - Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
- EN-62137-4 - Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
- EN-62421 - Electronics Assembly Technology, Electronic Modules
- EN-62739-1 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
- EN-62739-2 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
- EN-62739-3 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
- EN-62878-1-1 - Device embedded substrate - Part 1-1: Generic specification - Test methods
- EN-IEC-61190-1-3 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
- JIS-C-0806-2 - Packaging of components for automatic handling -- Part 2: Packaging of components with unidirectional leads on continuous tapes
- JIS-C-0806-3 - Part 3: Packaging of Surface Mount Components on Continuoustapes, Packaging of Component
- JIS-C-5070 - Surface mounting technology -- Part 2: Transportation and storage conditions of surface mounting devices (SMD) -- Application guide
- PD-IEC-61191-8 - Printed board assemblies