ASTM-D1867 › Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring (Withdrawn 2020)

ASTM-D1867 - 2013 EDITION - CANCELLED
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This specification covers twelve grades of thermosetting laminate with copper foil cladded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards. The laminates shall meet the following requirements: peel strength after solder float and at elevated temperature conditions; lengthwise and crosswise flexural strengths; flammability rating; water absorption; volume resistivity; dielectric breakdown parallel to laminations; dissipation factor; and permittivity. Warp or twist, and blistering requirements shall also be tested for conformance.

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Scope

1.1 This specification covers twelve grades of thermosetting laminate with copper foil bonded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Keywords

circuit board; copper-clad laminate; printed circuit board; printed wiring board; thermosetting laminate

To find similar documents by ASTM Volume:

10.01 (Electrical Insulation (I): D69 - D2484)

To find similar documents by classification:

31.180 (Printed circuits and boards)

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Document Number

ASTM-D1867-13

Revision Level

2013 EDITION

Status

Cancelled

Modification Type

Withdrawn

Publication Date

Nov. 15, 2013

Document Type

Specification

Page Count

5 pages

Committee Number

D09.07