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1.1 This test method covers the determination of the volume resistivity of resin-based conductive adhesives in the cured condition. The test is made on a thin adhesive layer as prepared in a bonded specimen. This test method is used for conductive adhesives that are cured either at room temperature or at elevated temperatures.

1.2 The values stated in either SI or other units shall be regarded separately as standard. SI equivalents to screw threads are shown in the figures.

1.3 This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.

1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.

5.1 Accurate measurement of the volume resistivity of conductive adhesives is important, particularly with respect to applications in electronic packaging techniques. This method measures the resistance of conductive adhesives used in thin films as part of a bonded assembly. This does not imply that the measured results are applicable to different configurations with different metals. This method may be used for acceptance testing and for screening materials.