ASTM-D5109 › Complete Document History
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)


Obsolete Revision Information:
   WITHDRAWN - WITHDRAWN WITHOUT REPLACEMENT - March 1, 2020
   2012 EDITION - Copper-Clad Thermosetting Laminates for Printed Wiring Boards - Dec. 1, 2012
   1999 R04 EDITION - REAPPROVED IN 2004 - Dec. 1, 2004
   1999 EDITION - COPPER-CLAD THERMOSETTING LAMI - Oct. 10, 1999
   1994 EDITION - COPPER-CLAD THERMOSETTING LAMI - Oct. 15, 1994
   1990 EDITION - COPPER-CLAD THERMOSETTING LAMI - Aug. 31, 1990