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Scope

1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.

1.2 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.

1.3 The procedures appear in the following sections:

Keywords

copper-clad laminate; dielectric breakdown parallel to laminations; dimensional instability; dissipation factor; fiber reinforced; flexural strength; industrial laminate; laminate; oven blister; peel strength; permittivity; printed circuit boards; printed wiring boards; rigid laminate; solder float; surface resistivity; thermoset; thickness variation; trace; twist; volume resistivity; warp; water absorption; ICS Number Code 31.180 (Printed circuits and boards); 83.140.20 (Laminated sheets)

To find similar documents by ASTM Volume:

10.02 (Electrical Insulation (II): D2518 - latest)

To find similar documents by classification:

31.180 (Printed circuits and boards)

83.140.20 (Laminated sheets)

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