ASTM-F1238 › Historical Revision Information
Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
Document Center Inc. is an authorized dealer of ASTM standards.
The following bibliographic material is provided to assist you with your purchasing decision:
The following bibliographic material is provided to assist you with your purchasing decision:
Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
Scope
1.1 This specification covers sputtering targets fabricated from metallic silicides (molybdenum silicide, tantalum silicide, titanium silicide, and tungsten silicide). These targets are referred to as refractory silicide targets, and are intended for use in microelectronic applications.
1.2 The values stated in SI units are regarded as standard.
Keywords
density; microelectronics; molybdenum; disilicide; refractory silicides; sputtering; sputtering targets; tantalum disilicide; titanium disilicide; tungsten disilicide; ICS Number Code 31.100 (Electronic tubes)
To find similar documents by ASTM Volume:
10.04 (Electronics; Declarable Substances in Materials; 3D Imaging Systems)
To find similar documents by classification:
This document comes with our free Notification Service, good for the life of the document.
This document is available in either Paper or PDF format.
Document Number
ASTM-F1238-95
Revision Level
1995 EDITION
Status
Superseded
Modification Type
Reapproval
Publication Date
Sept. 15, 1995
Document Type
Specification
Page Count
2 pages
Committee Number
F01.17