ASTM-F1238 › Historical Revision Information
Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
Show Complete Document History
The following bibliographic material is provided to assist you with your purchasing decision:
1.1 This specification covers sputtering targets fabricated from metallic silicides (molybdenum silicide, tantalum silicide, titanium silicide, and tungsten silicide). These targets are referred to as refractory silicide targets, and are intended for use in microelectronic applications.
1.2 The values stated in SI units are regarded as standard.
density; microelectronics; molybdenum; disilicide; refractory silicides; sputtering; sputtering targets; tantalum disilicide; titanium disilicide; tungsten disilicide; ICS Number Code 31.100 (Electronic tubes)
To find similar documents by ASTM Volume:
10.04 (Electronics; Declarable Substances in Materials; 3D Imaging Systems)
To find similar documents by classification:
This document comes with our free Notification Service, good for the life of the document.
This document is available in either Paper or PDF format.
Sept. 15, 1995