ASTM-F1709 › Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications (Withdrawn 2023)
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This specification covers high purity titanium sputtering targets for use as raw material in the fabrication of semiconductor electronic thin films. Material covered by this specification comprises Grades 4N, 4N5, and 5N titanium sputtering targets, the grades of which are based on the total metallic impurity content. The target shall be manufactured free of any contaminates such as dirt or oils and with average and maximum grain sizes in conformity with the requirements specified. The target shall be analyzed for trace metallic impurities, carbon, oxygen, sulfur, nitrogen, and hydrogen and shall conform to the grade requirements and the acceptable and minimum detection limits specified.
Scope
1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices.
1.2 This standard sets purity grade levels, physical attributes, analytical methods, and packaging.
1.2.1 The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance.
Keywords
coating; sputtering; target; thin film; titanium ;
To find similar documents by ASTM Volume:
10.04 (Electronics; Declarable Substances in Materials; 3D Imaging Systems)
To find similar documents by classification:
31.120 (Electronic display devices Including liquid crystal displays)
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Document Number
ASTM-F1709-97(2016)
Revision Level
1997 R16 EDITION
Status
Cancelled
Modification Type
Withdrawn
Publication Date
May 15, 2016
Document Type
Specification
Page Count
3 pages
Committee Number
F01.17