ASTM-F1893 Historical Revision Information
Guide for Measurement of Ionizing Dose-Rate Burnout of Semiconductor Devices

ASTM-F1893 - 1998 R03 EDITION - SUPERSEDED
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Guide for Measurement of Ionizing Dose-Rate Survivability and Burnout of Semiconductor Devices
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Scope

1.1 This guide defines the detailed requirements for testing microcircuits for short pulse high dose-rate ionization-induced failure. Large flash x-ray (FXR) machines operated in the photon mode, or FXR e-beam facilities are required because of the high dose-rate levels that are necessary to cause burnout. Two modes of test are possible (1) survival test, and (2) A failure level test.

1.2 The values stated in International System of Units (SI) are to be regarded as standard. No other units of measurement are included in this standard.

Keywords

burnout; failure; high dose-rate; integrated circuits; ionizing radiation; latchup; microcircuits; semiconductor devices; survivability; ICS Number Code 31.080.01 (Semi-conductor devices in general)

To find similar documents by ASTM Volume:

10.04 (Electronics; Declarable Substances in Materials; 3D Imaging Systems)

To find similar documents by classification:

31.080.01 (Semiconductor devices in general)

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Document Number

ASTM-F1893-98(2003)

Revision Level

1998 R03 EDITION

Status

Superseded

Modification Type

Reapproval

Publication Date

Dec. 1, 2003

Document Type

Guide

Page Count

5 pages

Committee Number

F01.11