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Scope

1.1 This practice covers a procedure for determining the solderability of thick-film conductors. The procedure has been adapted from several techniques that are in routine use for testing this property.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

1.3 This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of whoever uses this standard to consult and establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Significance and Use

The procedure of this practice is suitable for process control.

No interlaboratory precision has been established for the procedure of this practice. Therefore, this practice should not be used for the acceptance or rejection of material exchanged between buyers and sellers.

Keywords

hybrid microcircuits; solderability; solder wetting; thick-film metallization; ICS Number Code 29.050 (Superconductivity and conducting materials)

To find similar documents by ASTM Volume:

10.04 (Electronics; Declarable Substances in Materials; 3D Imaging Systems)

To find similar documents by classification:

29.050 (Superconductivity and conducting materials)

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