ASTM-F636 › Guide for Selection of Tests for Material Properties of Transfer Molding Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 1996)
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Guide for Selection of Tests for Material Properties of Transfer Molding Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 1996)
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Document Number
ASTM-F636-85(1991)
Revision Level
1985 EDITION
Status
Cancelled
Modification Type
Withdrawn
Publication Date
May 30, 1985
Document Type
Guide
Page Count
5 pages