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Scope

1.1 This specification covers standard formats for testable semiconductor lead carrier tape suitable for hybrid applications.

1.2 This standard specifies tape width, configuration, and location of guide perforations ("sprocket holes"), location of lead pattern frames on tape, lead pattern window size, and placement of outer lead bond and electrical test pad areas in the lead pattern.

1.3 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

1.4 The following hazard caveat pertains only to the test method portion, Section 7 of this specification. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Keywords

lead carrier tape; 19-mm testable tape carrier; semiconductor devices; tape carrier bonding; 35-mm testable tape carrier

To find similar documents by ASTM Volume:

10.04 (Electronics; Declarable Substances in Materials; 3D Imaging Systems)

To find similar documents by classification:

55.060 (Spools. Bobbins Including holders, supports, etc. for externally wound or mounted material Photographic and cinematographic film rolls, cores, spools, reels, etc., see 37.040.20 Photographic fils rolls, cores, spools, reels, etc., see 37.060.20 Cones, tubes, beams, etc. for textile materials, see 59.120.20)

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