BS-3934-5 › Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits
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Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits
Keywords
Mechanical behaviour of materials, Mechanical properties of materials, Standardization, Electronic equipment and components, Semiconductor devices, Integrated circuits, Flexible materials, Tape, Films (states of matter), Dimensions, Perforations, Electrical connections, Holes, Bonding, Codes, Datum, Dimensional tolerances
To find similar documents by classification:
31.080.01 (Semiconductor devices in general)
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Document Number
BS 3934-5:1997
Revision Level
1997 EDITION
Status
Current
Publication Date
Sept. 15, 1997
Replaces
BS 3934-5:1992
Page Count
38
ISBN
0580278123
International Equivalent
IEC 60191-5:1997
Committee Number
EH/3