BS-3934-5 Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits

BS-3934-5 - 1997 EDITION - CURRENT
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Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits

Keywords

Mechanical behaviour of materials, Mechanical properties of materials, Standardization, Electronic equipment and components, Semiconductor devices, Integrated circuits, Flexible materials, Tape, Films (states of matter), Dimensions, Perforations, Electrical connections, Holes, Bonding, Codes, Datum, Dimensional tolerances

To find similar documents by classification:

31.080.01 (Semiconductor devices in general)

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Document Number

BS 3934-5:1997

Revision Level

1997 EDITION

Status

Current

Publication Date

Sept. 15, 1997

Replaces

BS 3934-5:1992

Page Count

38

ISBN

0580278123

International Equivalent

IEC 60191-5:1997

Committee Number

EH/3