BS-3934-5 › Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits
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Mechanical behaviour of materials, Mechanical properties of materials, Standardization, Electronic equipment and components, Semiconductor devices, Integrated circuits, Flexible materials, Tape, Films (states of matter), Dimensions, Perforations, Electrical connections, Holes, Bonding, Codes, Datum, Dimensional tolerances
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Sept. 15, 1997