BS-4584-103.1 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board

BS-4584-103.1 - 1990 EDITION - SUPERSEDED
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Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board


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31.180 (Printed circuits and boards)

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Document Number

BS 4584-103.1:1990

Revision Level

1990 EDITION

Status

Superseded

Publication Date

Feb. 28, 1990

Page Count

12 pages