BS-EN-60191-6-3 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP)

BS-EN-60191-6-3 - 2001 EDITION - CURRENT


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Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP)

Keywords

Integrated circuits, Engineering drawings, Standardization, Semiconductor devices, Electronic equipment and components, Packages, Dimensions, Flat (shape), Drawings, Surface mounting devices

To find similar documents by classification:

01.100.25 (Electrical and electronics engineering drawings Including electrical tables, diagrams and charts)

31.080.01 (Semiconductor devices in general)

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Document Number

BS EN 60191-6-3:2001

Revision Level

2001 EDITION

Status

Current

Publication Date

May 15, 2001

Page Count

20

ISBN

058037243X

International Equivalent

EN 60191-6-3 (IEC 60191-6-3:20

Committee Number

EPL/47