BS-EN-61190-1-1 › Attachment materials for electronic assembly

BS-EN-61190-1-1 - 2002 EDITION - CURRENT


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Attachment materials for electronic assembly

Keywords

Soldering;Soldering fluxes;Electrical connections;Quality control;Bonding;Electronic engineering;Quality assurance;Electronic equipment and components

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31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

BS EN 61190-1-1:2002

Revision Level

2002 EDITION

Status

Current

Publication Date

Aug. 16, 2002

Page Count

26

ISBN

0580402614

International Equivalent

EN 61190-1-1 (IEC 61190-1-1:2002 AS);IEC 61190-1-1:2002

Committee Number

EPL/501