BS-EN-61191-3 › Historical Revision Information
Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies
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Printed board assemblies
Keywords
Printed-circuit boards;Electrical components;Joints;Printed circuits;Soldering;Holes;Wires;Boards;Microassembling;Electrical equipment;Defects;Surface properties;Electronic equipment and components;Integrated circuits;Semiconductor devices
To find similar documents by classification:
31.180 (Printed circuits and boards)
31.240 (Mechanical structures for electronic equipment)
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Document Number
BS EN 61191-3:2017
Revision Level
2017 EDITION
Status
Current
Publication Date
Sept. 25, 2017
Replaces
BS EN 61191-3:1999
Page Count
26
ISBN
9780580917226
International Equivalent
EN 61191-3:2017;IEC 61191-3:2017
Committee Number
EPL/501