BS-EN-61249-5-1 › Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings. Copper foils (for the manufacture of copper-clad base materials)

BS-EN-61249-5-1 - 1996 EDITION - CURRENT


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Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings. Copper foils (for the manufacture of copper-clad base materials)

Keywords

Printed-circuit boards, Printed circuits, Printed-circuit bases, Films (states of matter), Foil, Coatings, Copper, Metal coatings, Laminates, Flexible materials, Grades (quality), Classification systems, Surface properties, Designations, Thickness, Mass, Purity, Electrical conductivity, Electrical resistivity, Tensile strength, Elongation at fracture, Holes, Dimensions, Dimensional tolerances, Packaging, Marking, Surface treatment, Electrical testing

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31.180 (Printed circuits and boards)

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Document Number

BS EN 61249-5-1:1996

Revision Level

1996 EDITION

Status

Current

Publication Date

Sept. 15, 1996

Page Count

26

ISBN

0580261670

International Equivalent

EN 61249-5-1:1996 IEC 61249-5-1:1995

Committee Number

EPL/501