BS-EN-62047-15 Semiconductor devices. Micro-electromechanical devices. Test method of bonding strength between PDMS and glass

BS-EN-62047-15 - 2015 EDITION - CURRENT


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Semiconductor devices. Micro-electromechanical devices. Test method of bonding strength between PDMS and glass

Keywords

Thin films, Electronic equipment and components, Test specimens, Electromechanical devices, Axial stress, Semiconductor technology, Test equipment, Tensile testing, Semiconductor devices

To find similar documents by classification:

31.080.99 (Other semiconductor devices)

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Document Number

BS EN 62047-15:2015

Revision Level

2015 EDITION

Status

Current

Publication Date

July 31, 2015

Page Count

16

ISBN

9780580708022

International Equivalent

EN 62047-15:2015 IEC 62047-15:2015

Committee Number

EPL/47