BS-EN-62047-15 › Semiconductor devices. Micro-electromechanical devices. Test method of bonding strength between PDMS and glass
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Thin films, Electronic equipment and components, Test specimens, Electromechanical devices, Axial stress, Semiconductor technology, Test equipment, Tensile testing, Semiconductor devices
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BS EN 62047-15:2015
July 31, 2015
EN 62047-15 (IEC 62047-15:2015 IEC 62047-15:2015