BS-EN-62137 › Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

BS-EN-62137 - AMD 15607 - SUPERSEDED -- See the following: BS-EN-62137-4
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Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Keywords

Reliability;Soldering;Thermal stress;Printed circuits;Integrated circuits;Life (durability);Electronic equipment and components;Printed-circuit boards;Mechanical testing;Quality control;Environmental testing;Performance testing;Soldered joints;Surface mounting devices;Semiconductor devices;Endurance testing

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31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

BS-EN-62137

Revision Level

AMD 15607

Status

Superseded

Publication Date

May 13, 2005

International Equivalent

EN 60464-2:2001;IEC 62137:2004/COR1:2005

Committee Number

EPL/501