BS-EN-62137 Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

BS-EN-62137 - AMD 15607 - SUPERSEDED
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Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Keywords

Semiconductor devices, Surface mounting devices, Integrated circuits, Printed circuits, Printed-circuit boards, Electronic equipment and components, Soldered joints, Soldering, Environmental testing, Endurance testing, Life (durability), Mechanical testing, Thermal stress, Reliability, Performance testing, Quality control

To find similar documents by classification:

31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

BS-EN-62137

Revision Level

AMD 15607

Status

Superseded

Publication Date

May 13, 2005

International Equivalent

EN 62137:2004 IEC 62137:2004

Committee Number

EPL/501