BS-EN-62137 Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

BS-EN-62137 - AMD 15607 - SUPERSEDED
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Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Keywords

Reliability,Soldering,Thermal stress,Printed circuits,Integrated circuits,Life (durability),Electronic equipment and components,Printed-circuit boards,Mechanical testing,Quality control,Environmental testing,Performance testing,Soldered joints,Surface mounting devices,Semiconductor devices,Endurance testing

To find similar documents by classification:

31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

BS-EN-62137

Revision Level

AMD 15607

Status

Superseded

Publication Date

May 13, 2005

International Equivalent

EN 60464-2 (IEC 60464-2:2001 AS) IEC 62137:2004/COR1:2005

Committee Number

EPL/501