BS-EN-62418 › Semiconductor devices. Metallization stress void test
BS-EN-62418
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2010 EDITION
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CURRENT
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Semiconductor devices. Metallization stress void test
Keywords
Aluminium;Diffusion;Stress;Electrical measurement;Copper;Metals;Surfaces;Semiconductor devices;Electronic equipment and components;Visual inspection (testing);Semiconductors
To find similar documents by classification:
31.080.01 (Semiconductor devices in general)
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Document Number
BS EN 62418:2010
Revision Level
2010 EDITION
Status
Current
Publication Date
Aug. 31, 2010
Page Count
20
ISBN
9780580626104
International Equivalent
IEC 62418:2010;EN 62418:2010
Committee Number
EPL/47