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Keywords

Flammability;Moisture measurement;Defects;Solderability testing;Storage;Testing conditions;Visual inspection (testing);Marking;Stress;Fire tests;Test equipment;Vibration testing;Temperature measurement;Specimen preparation;Semiconductor devices;Accelerated testing;Bonding;Electric terminals;Electrical testing;Endurance testing;Test specimens;Thermal-shock tests;Environmental testing;Strength of materials;Mass spectrometry;Classification systems;Integrated circuits;Damp-heat tests;Shear testing;Low-pressure tests;Thermal testing;Mechanical testing;Leak tests;Radioactive tracer methods;Electronic equipment and components;Pull-out tests;Dimensional measurement;Torsion testing

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31.080.01 (Semiconductor devices in general)

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