BS-EN-IEC-61190-1-3 Attachment materials for electronic assembly

BS-EN-IEC-61190-1-3 - 2018 EDITION - CURRENT


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Attachment materials for electronic assembly

Keywords

Electrical connections;Solders;Pastes;Test methods;Quality assurance;Bonding;Particulate materials;Fluxes (materials);Soldering;Classification systems;Bars (materials);Quality control;Electronic engineering;Electronic equipment and components

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31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

BS EN IEC 61190-1-3:2018

Revision Level

2018 EDITION

Status

Current

Publication Date

March 28, 2018

Replaces

BS EN 61190-1-3:2007+A1:2010

Page Count

50

ISBN

9780580892387

International Equivalent

EN 60076-1:2011;IEC 61190-1-3:2017;EN IEC 61190-1-3:2018

Committee Number

EPL/501