BS-EN-IEC-61190-1-3 › Attachment materials for electronic assembly
BS-EN-IEC-61190-1-3
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2018 EDITION
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CURRENT
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Attachment materials for electronic assembly
Keywords
Electrical connections;Solders;Pastes;Test methods;Quality assurance;Bonding;Particulate materials;Fluxes (materials);Soldering;Classification systems;Bars (materials);Quality control;Electronic engineering;Electronic equipment and components
To find similar documents by classification:
31.190 (Electronic component assemblies Including preassembled modules)
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Document Number
BS EN IEC 61190-1-3:2018
Revision Level
2018 EDITION
Status
Current
Publication Date
March 28, 2018
Replaces
BS EN 61190-1-3:2007+A1:2010
Page Count
50
ISBN
9780580892387
International Equivalent
EN 60076-1:2011;IEC 61190-1-3:2017;EN IEC 61190-1-3:2018
Committee Number
EPL/501