BS-EN-IEC-61190-1-3-TC › Tracked Changes. Attachment materials for electronic assembly

BS-EN-IEC-61190-1-3-TC - 2018 EDITION - CURRENT


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Tracked Changes. Attachment materials for electronic assembly

Keywords

Electrical connections;Solders;Pastes;Test methods;Quality assurance;Bonding;Particulate materials;Fluxes (materials);Soldering;Classification systems;Bars (materials);Quality control;Electronic engineering;Electronic equipment and components

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31.190 (Electronic component assemblies Including preassembled modules)

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Document Number

BS EN IEC 61190-1-3:2018 - TC

Revision Level

2018 EDITION

Status

Current

Publication Date

Feb. 27, 2020

ISBN

9780539111422

Committee Number

EPL/501